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Bumping




WLCSP Package Roadmap

Technology Item Available 2007 2008 2009
DCOB* FOC Pitch (um) 180 150 - -
REP 200 200 150 -
RDL Pitch (um) I/O 85 75 65 65
Bump 225 200 150 150
aCSP (um) REP Ball Pitch (um) 400 300 200 150
Ball Size (um) 250 150 100 80

RDL

 Pitch (um) I/O 85 75 65 65
Ball 400 300 200 150
Ball Size (um) 250 150 100 80
aCSP (Ball Drop) Wafer Size (mm) 150/200 300 300 300
RDL Runner Material Sputtered Metal Sputtered Metal Plated Cu Embedded Passives
on Chip
Fan-out WLCSP Structure N/A Prototype Single Die Stack

* DCOB means Direct Chip on Board
* aCSP is ASE trademark for WLCSP



Bumping WLCSP Packaging Technology

Package Item Available 2007 2008 2009
Bumping UBM Al/NiV/Cu
Ti/NiV/Cu
Ti/Cu/Cu/Ni
Ti/Cu/Ni 		- - -
Pitch (Printed/Plated, um) 180/150 150/130 150/120 150/100
Bump Composition Eutectic
Hi-Pb /Pb-free		 Plated
Pb-free		 - -
Repassivation BCB/PI/PBO PI New Polymer - -
aCSP Wafer Thickness (um) 200mm – 250
300 mm – N/A		 200
250 		150
200		 150
200
Ball Pitch (um) 400 300 200 150
Ball Size (um) 250 150 100 80




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