ASE Kaohsiung

Dual-in-Line SOP/SSOP

Product Overview

The features of small outline package (SOP) are similar to SOJ, except that the leads' end is formed in the shape of a gull-wing. SSOP is the shrunk version of SOP, with lead pitch narrowed from 1.27mm (50mil) to 0.635mm (25mil). The shrunk body means flexible layout within finite PCB area. Another advantage is that shorter leads improve the electrical performance.

Application

ASE’s SOP/SSOP product was designed in compliance with JEDEC standards. Applications includes low pin count packages used in cellular phones, wireless LAN, personal digital assistants, digital cameras, video, and information appliances.

Features

SOP Body sizes 154 up to 450 mils

SSOP Body sizes 300 mils

SOP lead counts available from 8 to 32

SSOP lead counts available 48 & 56

JEDEC standard outlines

Existing BOM and process flow

Pb-free process ready and available

Reliability

Package Level

Temp/Humidity test	85°C/ 85% RH, 1000 hr (JEDEC 22- A101)
Pressure cooker test	121°C/ 100% RH/ 15 PSIG, 300 hr (JEDEC 22- A102)
Temp cyclic test	-65 ~ 150°C, 1000 CYCLES (MIL-STD-883-1010.7)
High temp storage test	150°C, 1000 hr (JEDEC 22- A103)
High accelerated stress test	130°C/ 85% RH/ 33.5 PSIA, 100 hr (JEDEC 22- A110)

Board Level (Contact ASE for further details.)

For more information, please contact ASE sales office.