| Product Overview |
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| Small Outline J-leaded (SOJ) is similar to PDIP, but the leads' end is formed in a "J"-shape to be folded under the body. This is to reduce the foot space. With the increasing popularity of SMT and with a smaller outline than PDIP, SOJ is widely used to complement PDIP. |
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| Application |
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Due to its thin profile, TSOP is suitable for applications in portable electronic products, cell phones and memory modules. LOC technology can be applied to TSOP(II).
Telecommunication Products:
Cellular Phone
Wireless LAN
Portable Products:
Personal Digital Assistants
Digital Camera
Audio/Video
Low Pin Count Packages:
Information Appliances |
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| Features |
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 Low profile and lightweight
Existing BOM
Steady yield
Low cost
Pb-free available
SOJ body sizes from 675 up to 1125 mils
SOJ Tape-LOC lead counts 24/42
JEDEC standard outlines
Existing BOM and process flow |
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| Reliability |
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| Package Level |
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| JEDEC precondition level 3 |
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| Visual Inspection |
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| Open/Short Test |
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| SAT Inspection |
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| Temperature Cycling |
150°C~-65°C |
5 Cycles |
| Baking @ 125°C/24 Hours |
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| Moisture Soak |
30°C/60%RH |
192 Hours |
| IR reflow |
225°C/3X |
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| Visual Inspection |
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| Open/Short Test |
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| SAT Inspection |
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| Temperature/Humidity test |
85°C/85%RH |
500 /1000 hours |
| Thermal shock |
-65°C~150°C |
100 / 300 / 500 cycles |
| Pressure cooker test |
121°C/100%RH/15 psig |
168 / 300 hours |
| Temperature cycles |
-65°C~150°C |
100 / 300 / 500 / 1000 cycles |
| HTST |
150°C |
500 / 1000 hours |
| HAST |
130°C/85%RH |
50 / 100 hours |
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| Board Level (Contact ASE R&D for details.) |
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| Design Rule |
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| Minimum Ink Size: 15mil (381 um) diameter or non-ink with wafer mapping |
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| Minimum Sawing street width: 3.0 mil (76.2 um) |
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| Wafer Thickness: Back grinding is required if the thickness exceeds ASE's stipulated range |
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| Pkg type |
Wafer thickness |
| SOJ |
10~25 mil (280~635 um) |
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| Wire Bond Rule |
| Wire size |
Min. bond pad pitch |
Min. bond pad opening |
Wire loop control |
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| 32 um (1.3mil) |
140 um |
96 um |
Max. wire length
loop height |
180
<20 mils |
| 30 um (1.2mil) |
90 um |
69 um |
Max. wire length
loop height |
180
<20 mils |
| 28 um (1.1mil) |
90 um |
65 um |
Max. wire length
loop height |
180
11~15 mils |
| 25 um (1.0mil) |
75 um |
63 um |
Max. wire length
loop height |
176
11~15 mils |
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| (1mm=39.37mil; 1mil=25.4um) |
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| Performance |
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| Electrical |
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| Electrical Characterization (Contact ASE R&D for details.) |
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| Thermal |
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SOJ (All are measurement data.)
| Lead count |
Pkg size (mm) |
Pad size (mil) |
Die size (mil) |
L/F material |
PCB layer |
 JA(c/w) |
| 0(m/s) |
1(m/s) |
2(m/s) |
| 20 |
300X675 |
180X285 |
100X100 |
Cu |
2L |
80.1 |
70.5 |
58.8 |
| 28 |
300X170 |
240X352 |
200X200 |
A42 |
2L |
62 |
51.1 |
42 |
| 32 |
300X825 |
180X265 |
100X100 |
Cu |
2L |
60.4 |
50.6 |
44.3 |
| 40 |
400X1025 |
180X212 |
100X100 |
Cu |
4L |
39.7 |
36.4 |
33.2 |
| 40 |
400X1025 |
240X400 |
200X200 |
Cu |
2L |
52.2 |
46.2 |
40.5 |
| 40 |
400X1025 |
250X470 |
200X200 |
Cu |
2L |
50.5 |
42.2 |
35.5 |
| 42 |
400X1075 |
260X550 |
200X200 |
A42 |
2L |
70.8 |
60.3 |
53.5 |
| 44 |
400X1025 |
257X467 |
200X200 |
Cu |
2L |
38.8 |
32.8 |
28.2 |
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(1mm=39.37mil; 1mil=25.4um)
The above electrical data is for reference only. |
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| Standard Process/Materials |
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| SOJ |
| Wafer mount |
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| Wafer saw/Clean |
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| 2nd optical (Gate) |
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| Die attach |
Epoxy: ABLESTIK 8361H
Lead frame: OLIN 194 (Cu)/A42 |
| Epoxy cure |
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| Wire bond |
Gold wire: 99.99% Au |
| 3rd optical (Gate) |
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| Mold |
Compound: SUMITOMO EME-6600CS
 SUMITOMO EME-S372 (Memory device) |
| Laser backside marking |
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| Dejunk/Trim |
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| Post mold cure |
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| Electro deflash |
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| Solder plating |
Solder: Sn/Pb=85/15 |
| Top side marking |
White ink |
| Visual/Mechanical inspection (Gate) |
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| Form/Singulation |
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| Final visual inspection (Gate) |
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| Packing |
Anti-static tube |
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| Optional process: wafer back grinding/die coating |
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| Package Offering |
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| The alphabetical notation refers to: |
| A1 Stand-off |
| A2 Body thickness |
| b Lead width |
| c L/F thickness |
| e Lead pitch |
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| Overall thickness is the sum of A1 and A2. |
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| SOJ(All units are in mil. 1mil=25.4um) |
| Body size |
Lead count |
A1 |
A2 |
b |
c |
e |
| D1 |
E1 |
| 675 |
300 |
20/24/26 |
25 |
100 |
18 |
10 |
50 |
| 710 |
300 |
28 |
25 |
100 |
18 |
10 |
50 |
| 724 |
400 |
24/28 |
25 |
110 |
17 |
8 |
50 |
| 825 |
300 |
32 |
25 |
100 |
18 |
8 |
50 |
| 825 |
400 |
32 |
40 |
98 |
18 |
8 |
50 |
| 925 |
400 |
36 |
40 |
98 |
18 |
8 |
50 |
| 1025 |
400 |
40 |
25 |
110 |
18 |
10 |
50 |
| 1075 |
400 |
42 |
25 |
110 |
18 |
8 |
50 |
| 1125 |
400 |
44 |
25 |
110 |
17 |
8 |
50 |
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| Packing & Shipping |
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| SOJ |
| Body width (mil) |
Lead count |
Total QTY |
Vendor |
| 300 |
20/24/26 |
27 |
KO |
| 300 |
28 |
25 |
KO |
| 300 |
32 |
22 |
KO |
| 400 |
24/28 |
24 |
KO |
| 400 |
32 |
21 |
KO/EG |
| 400 |
36 |
19 |
KO/EG |
| 400 |
40 |
17 |
KO/EG |
| 400 |
42 |
16 |
KO/EG |
| 400 |
44 |
15 |
KT |
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