| SOP/SSOP |
| Wafer mount |
|
| Wafer saw/Clean |
|
| 2nd optical (Gate) |
|
| Die attach |
Epoxy: ABLESTIK 8360
Lead frame: OLIN 194 (Cu) |
| Epoxy cure |
|
| Wire bond |
Gold wire: 99.99% Au |
| 3rd optical (Gate) |
|
| Mold |
Compound: SUMITOMO EME-6600CS) |
| Laser backside marking |
|
| Top side laser marking |
SSOP/SOP of 150 mil body width |
| Post mold cure |
|
| Electrodeflash |
|
| Solder plating |
Solder: Sn/Pb=85/15 |
| Top side marking...330, 450 mil SOP |
White ink |
| Visual/Mechanical inspection (Gate) |
|
| Form/Singulation...330, 450 mil SOP |
(Dejunk/Trim/Form/Singulation...SSOP/SOP of
150 mil body width) |
| Final visual inspection (Gate) |
|
| Packing |
Anti-static tube |