| Product Overview |
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| Small Outline J-leaded (SOJ) package is similar to PDIP, but the leads’ end are formed in a “J”-shape to be folded under the body. This aims to reduce the foot print. With the increasing popularity of SMT and with a smaller outline than PDIP, SOJ is widely used to complement PDIP. |
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| Application |
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Telecommunication Products
Cellular Phone
Wireless LAN
Portable Products
Personal Digital Assistants
Digital Camera
Audio/Video
Low Pin Count Packages
Information Appliances |
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| Features |
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| Low profiles and lightweight |
| Steady yield |
| Low cost |
| SOJ body sizes from 710 up to 1125 mils |
| Pb-free Process ready and available |
| JEDEC standard outlines |
| Existing BOM and process flow |
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| Reliability |
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| Package Level |
| Test Item |
Reference Standard |
Condition/Duration |
| MSL |
JEDEC 22-A103 |
Level 3, 30°C/60% RH, 192 hrs |
| TCT |
JEDEC 22-A104-B |
-65°C to 150°C, 100/30/500/1000 cycles |
| HAST |
JEDEC 22-A118 |
130°C/85% RH, 33.5 PSI 48/96 hrs |
| HTST |
JEDEC 22-A103-B |
150°C, 500/1000 hrs |
| THT |
JEDEC 22-A101-B |
85°C/85%RH 500/1000 hrs |
| PCT |
JEDEC 22-A102 |
121°C/100%RH/15 psi, 96/168 hours |
| Thermal shock test |
JEDEC JESD22-A106 |
-65°C~150°C, 100/300/500 cycles |
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| Board Level (Contact ASE for further details.) |
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