ASE Kaohsiung

Dual-in-Line SOP/SSOP

Product Overview

The features of the small outline package (SOP) are similar to SOJ, but the leads' ends are formed in the shape of gull-wings. SSOP is the smaller version of SOP, with lead pitch narrowed from 1.27mm (50 mil) to 0.635mm (25 mil). The shrunk body means flexible layout within finite PCB area. Another advantage is that shorter leads improve the electrical performance.

Application

ASE's SOP/SSOP product was designed in compliance with JEDEC standard. The applications include low pin count packages used in cellular phones, wireless LAN, portable products, personal digital assistants, digital cameras, video and information appliances.

Features

SOP body sizes 150 up to 450 mils

SSOP body sizes 300 mils

SOP lead counts available from 8 to 32

SSOP lead counts available 48 & 56

JEDEC standard outlines

Existing BOM and process flow

Pb free available

Reliability

Package Level

All the dual-in-line packages selected for temperature/humidity test and temperature cycles are subjected to precondition process per JEDEC moisture LEVEL3 prior to environ-mental stress. Test criterion is zero defect out of 45 sample units.

Temp/Humidity test	85°C/ 85% RH, 1000 hr (JEDEC 22- A101)
Pressure cooker test	121°C/ 100% RH/ 15 PSIG, 300 hr (JEDEC 22- A102)
Temp cyclic test	-65 ~ 150°C, 1000 CYCLES (MIL-STD-883-1010.7)
High temp storage test	150°C, 1000 hr (JEDEC 22- A103)
High accelerated stress test	130°C/ 85% RH/ 33.5 PSIA, 100 hr (JEDEC 22- A110)

Design Rule

Minimum Ink Size: 15mil (381 um) diameter or non-ink with wafer mapping

Minimum Sawing street width: 3.0 mil (76.2 um)

Wafer Thickness: Back grinding is required if the thickness exceeds ASE's stipulated range

Package type	Package size	Wafer thickness
SOP	330 mil	11~30 mil (280~762 um)
SOP	150 mil	11~16 mil (280~406 um)
SSOP	All	11~25 mil (280~635 um)

Wire Bond Rule
Wire size	Min. bond pad pitch	Min. bond pad opening	Wire loop control
32 um (1.3mil)	140 um	96 um	Max. wire length loop height	180 <20 mils
30 um (1.2mil)	90 um	69 um	Max. wire length loop height	180 <20 mils
28 um (1.1mil)	90 um	65 um	Max. wire length loop height	180 11~15 mils
25 um (1.0mil)	75 um	63 um	Max. wire length loop height	176 11~15 mils

(1mm=39.37mil; 1mil=25.4um)

Performance

Electrical

Electrical Characterization (Contact ASE R&D for details.)

SSOP
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(1mm=39.37mil; 1mil=25.4um)
The above electrical data is for reference only.

Thermal (Contact ASE R&D for details.)

Standard Process/Materials

SOP/SSOP
Wafer mount
Wafer saw/Clean
2nd optical (Gate)
Die attach	Epoxy: ABLESTIK 8360 Lead frame: OLIN 194 (Cu)
Epoxy cure
Wire bond	Gold wire: 99.99% Au
3rd optical (Gate)
Mold	Compound: SUMITOMO EME-6600CS)
Laser backside marking
Top side laser marking	SSOP/SOP of 150 mil body width
Post mold cure
Electrodeflash
Solder plating	Solder: Sn/Pb=85/15
Top side marking...330, 450 mil SOP	White ink
Visual/Mechanical inspection (Gate)
Form/Singulation...330, 450 mil SOP	(Dejunk/Trim/Form/Singulation...SSOP/SOP of 150 mil body width)
Final visual inspection (Gate)
Packing	Anti-static tube

Optional process: wafer back grinding/die coating

Package Offering

The alphabetical notation refers to:

A2 Body thickness

L1 Lead length

b Lead width

c L/F thickness

e Lead pitch

SOP(All units are in mil. 1mil=25.4um)
Body size		Lead count	A1	A2	L1	b	c	e
D1	E1	Lead count	A1	A2	L1	b	c	e
193	150	8	6	55	42	16	8	50
193	150	8	1.6	55	42	16	8	50
193	154	8	6	55	42	16	8	50
340	150	14	6	55	42	16	8	50
341	154	14	6	55	42	16	8	50
390	150	16	6	55	42	16	8	50
390	154	16	6	55	42	16	8	50
405	300	16	6	92	55	16	10	25
405	300	32	6	92	55	16	10	50
505	300	20	6	92	55	16	10	50
605	300	24	6	92	55	16	10	50
713	330	28	7.5	98	67	16	10	50
713	331	28	6	98	67	16	10	50
805	445	32	6	106	55	16	8	50
805	450	32	6	106	55	16	8	50
1110	500	44	6	106	67	16	8	50

SSOP(All units are in mil. 1mil=25.4um)
Body size		Lead count	A1	A2	L1	b	c	e
D1	E1
625	295	48	12	94	56	10	8	25
725	295	56	12	94	56	10	8	25

Packing & Shipping

SOP
Body width(mil)	Lead count	Total QTY	Vendor
150	8	98	KO
150	14	56	KO
150	16	48	KO
330	28	25	KO
450	32	25	KO

SSOP
Body width(mil)	Lead count	Total QTY	Vendor
300	48	30	KO
300	56	26	KO