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QUAD  QFP




Product Overview
 
Quad flat package (QFP) is popular among quad packages. The fine lead frame via etching or stamping process enables QFP to contain more leads and feature a smaller profile (the lead width can be as small as 0.16mm while the lead pitch is 0.4mm). The thinner and flexible leads in gull-wing shape also provide better 2nd-level reliability (package to PCB).
 
QFP with Heat Spreader
 
The package with drop-in HS can allow more than 50% power dissipation when compared with the conventional package (e.g. in QFP 28x28mm, the allowable power of standard type and the type with HS is about 2.1W and 3.5W respectively). This drop-in HS drives off the heat from the chip more easily by extending the conduction area, and transfers more heat via the lead frame. QFP with drop-in HS is applicable to package sizes of 14x20, 28x28, and 32x32 mm.



Application
 
Quad packages have been used for years to meet increasing challenges of faster processors/controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipset, video-DAC, multi-media and other related applications. QFP applications are widely used in consumer and industrial products, automotive technology, PCs and other related products.



Features
 
Real chip size(smallest, thinnest and lightest)
High-speed data processing
High density interconnection
MCM assembly process



Reliability
 
Visual inspection
Open/Short test
SAT inspection
Temperature cycling -65°C~150°C/5 cycles
Baking@125°C/24hours
Moisture Soak: 30°C/60%RH/192 hours
IR reflow: 220°C/3X
Visual inspection
Open/Short test
SAT inspection
Electrical



Design Rule
 
Minimum sawing street width: 3mils(76um)
Standard die thickness: 11~30 mils(280~762um)
MCM die thickness: 9~11mils
Minimum space between die edge to pad edge: 8mil and 30mil with ground bond
MCM minimum space between top die edge to bottom die bond edge: 30mils
Minimum bond pad pitch: 55um(in line) and 40um(staggered)
Minimum bond pad open: 48um(in line) and 65um(staggered)

Maximum wire length:

1.2mil diameter 210mils
1.0mil diameter 190mils
0.9mil diameter 170mils
0.8mil diameter 150mils
 
(1mm=39.37mil; 1mil=25.4um)



Performance
 
Electrical
 
Electrical Characterization (Contact ASE R&D for details.)
 
QFP  
 
(1mm=39.37mil; 1mil=25.4um)
The above electrical data is for reference only.
 
Thermal (Contact ASE R&D for details.)
 
Lead
count		 Pkg size
(mm)		 Pad size
(mil)		 Die size
(mil)		 L/F
material		 Heat
spreader		 PCB
layer		 JA(c/w)
0(m/s) 1(m/s) 2(m/s)
44 10X10 205X205 170X170 Cu - 4L 52.6 44.1 40.2
44 10X10 275X275 200X200 A42 - 4L 61.2 55.9 51.7
52 10X10 210X210 180X180 Cu - 4L 48.5 40.3 36.6
52 10X10 280X280 200X200 A42 - 4L 57.7 52.7 48.7
64 14X20 200X200 180X180 Cu Y 4L 27.4 22.5 19.7
64 14X20 200X200 180X180 Cu - 4L 59.3 51.2 47.3
64 14X20 310X230 200X200 A42 - 4L 61.5 55.8 52.6
80 14X20 240X240 100X100 Cu - 4L 43.8 41 38.8
80 14X20 240X240 100X100 Cu Y 4L 26.2 21.3 18.5
100 14X20 236X236 200X200 Cu Y 2L 24.9 22.5 19.4
100 14X20 236X236 200X200 Cu - 2L 39 35 31.3
100 14X20 236X236 200X200 Cu - 4L 33.4 30.4 27.4
100 14X20 236X236 200X200 Cu Y 4L 24.9 22.5 19.4
100 14X20 315X315 200X200 Cu - 4L 32.9 29.2 26.5
100 14X20 315X315 250X250 Cu - 4L 31.8 28.4 25.8
120 28X28 354X354 200X200 Cu - 4L 32.4 30.8 29.3
120 28X28 354X354 310X310 Cu Y 4L 20.6 16.8 14.3
128 14X20 374X374 200X200 Cu - 4L 33.8 31.1 29.5
128 28X28 354X354 200X200 Cu - 4L 31 28.8 27.2
144 28X28 340X340 200X200 A42 - 4L 47.9 44.7 43.1
144 28X28 340X340 200X200 A42 Y 4L 30.5 28.2 27
144 28X28 340X340 300X300 Cu Y 4L 20 16.6 14.4
144 28X28 340X340 300X300 Cu - 4L 40.3 33.9 30.9
160 28X28 449X449 300X300 Cu Y 4L 15.8 14.7 13.4
160 28X28 449X449 300X300 Cu - 4L 24 22.4 21
208 28X28 405X405 100X100 Cu - 4L 37 35.9 34.1
208 28X28 405X405 200X200 A42 - 4L 48 45.3 43.2
208 28X28 405X405 200X200 Cu - 4L 30.1 28.5 27.1
208 28X28 405X405 200X200 Cu Y 4L 21.1 17.9 15.7
208 28X28 405X405 300X300 Cu Y 4L 16.7 14.6 13.3
208 28X28 405X405 400X400 Cu Y 4L 15.5 13.4 12.2
240 32X32 405X405 100X100 Cu - 4L 35.7 33.5 32
240 32X32 405X405 100X100 Cu Y 4L 20.8 18.8 17.3
240 32X32 405X405 200X200 Cu - 4L 32 29.8 27.5
240 32X32 405X405 200X200 Cu Y 4L 17.2 15.4 14.2
240 32X32 405X405 300X300 Cu - 4L 30.7 28.6 26.5
240 32X32 405X405 300X300 Cu Y 4L 16.2 14.4 13.3
240 32X32 405X405 354X354 Cu Y 4L 15.7 14.8 12.8
240 32X32 550X550 400X400 Cu - 4L 24.3 23.2 21.9
256 28X28 405X405 200X200 Cu - 4L 32.9 30.1 28.3
256 28X28 405X405 300X300 Cu - 4L 29.7 27.3 25.6
 
(1mm=39.37mil; 1mil=25.4um)
The above electrical data is for reference only.



Standard Process/Materials
 
QFP/QFP with Drop-in HS
Wafer mount  
Wafer saw/Clean  
2nd optical (Gate)  
Die attach Epoxy: SUMITOMO 1033D
Lead frame
QFP:C7025(Cu)/A42
HQFP & QFP with heat spreader:C7025(Cu)
Epoxy cure  
Wire bond Gold wire: 99.99% Au
3rd optical (Gate)  
Mold(Mold+heat spreader planting) Compound: SUMITOMO EME-6600CS
Laser backside marking  
Dejunk/Trim  
Post mold cure  
Electro deflash  
Solder plating Solder: Sn/Pb=85/15
Top side marking White ink
Visual/Mechanical inspection (Gate)  
Form/Singulation  
Final visual inspection (Gate)  
Packing Backable thin tray
 
Optional process: wafer back grinding/die coating/top side laser marking/dry packing



BOM of Pb Free Process
 
QFP/QFP with Drop-in HS
Die attach Epoxy: SUMITOMO 1076DS
Lead frame QFP:SUM/ASEMTL
HQFP & QFP with heat spreader:C7025(Cu)  
Wire bond Gold wire: 99.99% Au
Mold(Mold+heat spreader planting) Compound: SUMITOMO G700A
Solder plating Solder: Sn/Cu
Qual run status  
MSL2/260°C Pass  



Package Offering
 
The alphabetical notation refers to:
A1 Stand-off
A2 Body thickness
L1 Lead length
b Lead width
c L/F thickness
e Lead pitch
 
Overall thickness is the sum of A1 and A2.
 
QFP (All units are in mil. 1mil=25.4um)
Body size Lead count A1 A2 L1 b c e
D1 E1
10 10 44* 0.1 2.05 1.15 0.3 0.15 0.8
10 10 44* 0.2 2.05 2.5 0.3 0.15 0.8
10 10 44* 0.25 2.05 1.6 0.3 0.15 0.8
10 10 44* 0.25 2.05 1.95 0.3 0.15 0.8
10 10 48* 0.1 2.05 1.15 0.3 0.15 0.75
10 10 48* 0.2 2.05 2.5 0.3 0.15 0.75
10 10 48* 0.25 2.05 1.6 0.3 0.15 0.75
10 10 48* 0.25 2.05 1.95 0.3 0.15 0.65
10 10 52* 0.1 2.05 1.15 0.3 0.15 0.65
10 10 52* 0.2 2.05 2.5 0.3 0.15 0.65
10 10 52* 0.25 2.05 1.6 0.3 0.15 0.65
10 10 52* 0.25 2.05 1.95 0.3 0.15 0.65
14 20 64** 0.25 2.72 1.6/1.8/1.95/2.5 0.4 0.15 1
14 20 80** 0.25 2.72 1.6/1.8/1.95/2.5 0.35 0.15 0.8
14 20 100* 0.25 2.72 1.6/1.8/1.95 0.3 0.15 0.65
14 20 128 0.25 2.72 1.6/1.95/2.5 0.2 0.15 0.5
28 28 120** 0.25 3.32 1.3/1.6/1.95 0.35 0.15 0.8
28 28 128** 0.25 3.32 1.3/1.6/1.95 0.35 0.15 0.8
28 28 132 0.25 3.32 1.3/1.6 0.35 0.15 0.8
28 28 144** 0.25 3.32 1.3/1.6/1.95 0.3 0.15 0.65
28 28 160** 0.25 3.32 1.3/1.6/1.95 0.35 0.15 0.65
28 28 208** 0.25 3.32 1.3/1.6/1.95 0.2 0.15 0.5
28 28 256** 0.25 3.32 1.3/1.6/1.95 0.16 0.15 0.4
32 32 240 0.25 3.32 1.3 0.2 0.15 0.5



Packing & Shipping
 
QFP
Body width(mm) Description Row Column Total QTY Temp(°C) Vendor
10X10 JEDEC 6 16 96 150 SHINON
14X20 EIAJ 5 10 50 125 HS/KO
14X20 JEDEC 6 11 66 150 SHINON
28X28 EIAJ 3 8 24 125 KO/HS
28X28 JEDEC 3 8 24 150 SHINON
32X32 JEDEC 3 8 24 150 SHINON



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