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QUAD  LQFP/TQFP





Product Overview
 
Low profile and thin quad flat packages (QFP) are classified by the overall thickness (t) according to JEDEC definition:
L type: 1.2< t <=1.7 mm
T type: 1< t <=1.2 mm
Low profile and thin QFPs are becoming popular, as they are they are ideal for applications in lightweight and portable electronic products. ASE offers LQFP/TQFP packages in lead counts ranging from 32 to 256 and 44 to 128 respectively, covering almost all the applications in memory, DSP, and communication ICs. Due to the low electrical parasitic out of the small outline and shorter leads, low and thin QFPs are suitable for RFICs and an economical alternative to QFPs.



Application
 
Telecommunication products
 
Cellular phones
Wireless LAN
 
Portable products
 
Personal computers
Personal digital assistants
Digital cameras
 
Medium lead count packages
 
Information appliances
 
LQFP / TQFP
 
LQFPs are ideal packages for lightweight and portable electronic products requiring broad performance characteristics. The low electrical parasitic out of the small outline and shorter leads makes LQFP suitable for RFICs. Other LQFP applications include notebooks PCs, memory, video ASIC, DSP, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chip sets, telecom, office equipment, disc drives and communication boards.
 
EP-LQFP/EP-TQFP
 
Exposed Pad LQFP/TQFP provides better thermal performance which gives IC designers the needed margin for high performance products. Common applications of EP-LQFP/EP-TQFP packages are telecommunication and wireless products.



Features
 
LQFP/EP-LQFP Packing Offering
7x7mm to 28x28mm body size available
Wide selection of pad size to meet die requirements
Customized leadframe design capability
32~256 leads counts available
Fine pitch wirebond capability
Pb free process ready and available
High conductivity copper leadframes
Low stress die attach materials
Power enhancement version
JEDEC standard compliant
 
TQFP/EP-TQFP Packing Offering
10x10mm to 20x20mm body size available
Wide selection of pad size to meet die requirements
Customized leadframe design capability
44~176 leads counts available
Fine pitch wirebond capability
Pb free process ready and available
High conductivity copper leadframes
Low stress die attach materials
Power enhancement version
JEDEC standard complian



Reliability
 
Package Level
 
JEDEC precondition level 3
Visual inspection
Open/Short test
SAT inspection
Temperature cycling -65°C~150°C/5 cycles
Baking @125°C/24 hours
Moisture soak: 30°C/60% RH/192 hours
IR reflow: 225°C/3X
Visual Inspection
Open/Short test
SAT inspection
Temperature/Humidity test (85°C/85% RH)
500/1000 hours
Thermal shock (-65°C~150°C)
100/300/500 cycles
Pressure cooker test (121°C/100% RH/15 psig)
168/300 hours
Temperature cycles (-65°C~150°C)
100/300/500/1000 cycles
HTST (150)
500/1000 hours
HAST (130°C/85% RH)
50/100 hours
 
Board Level (Contact ASE R&D for details.)
 
Electrical (Contact ASE R&D for electrical deta.)



Design Rule
 
Minimum Ink Size: 15mil (381 um) diameter or non-ink with wafer mapping
 
Minimum Sawing street width: 3.0 mil (76.2 um)
 
Minimum sawing street width: 3mils(76um)
Standard die thickness: 11~30 mils(280~762um)
MCM die thickness: 9~11mils
Minimum space between die edge to pad edge: 8mil and 30mil with ground bond
MCM minimum space between top die edge to bottom die bond edge: 30mils
Minimum bond pad pitch: 55um(in line) and 40um(staggered)
Minimum bond pad open: 48um(in line) and 65um(staggered)

Maximum wire length:

1.2mil diameter 210mils
1.0mil diameter 190mils
0.9mil diameter 170mils
0.8mil diameter 150mils
 
Minimum Spacing Between Die and Lead Frame Paddle Edge(A):
8mil (0.2 um)/30mil (0.76um) with ground bond
 
Minimum Bond Pad Pitch (In Line)(B): 2.36 mil (60um)
 
Minimum Bond Pad Pitch (Staggered)(C): N/A
 
Minimum Bond Pad Opening(D):
In Line: 2.24 mil(57 um)/1.0 mil wire diameter
Staggered: N/A
 
Maximum Wire Length(L): 220mil(5.6mm) for LQFP/180 mil(4.6mm) for TQFP
 
Stack Die for EP-LQFP
1.Wafer thickness: 141 mils
2.Minimum distance of die edge between top die and bottom die: 30 mils
3.Minimum distance from bottom die edge to pad page: 8 mils(without ground line)
4.Minimum distance from bottom die edge to pad page: 30 mils(with ground line)
 
Stack Die for EP-TQFP
1.Wafer thickness: 101 mils
2.Minimum distance of die edge between top die and bottom die: 30 mils
3.Minimum distance from bottom die edge to pad page: 8 mils(without ground line)
4.Minimum distance from bottom die edge to pad page: 30 mils(with ground line)



Performance
 
Electrical
 
LQFP  
 
TQFP  
 
(1mm=39.37mil; 1mil=25.4um)
The above electrical data is for reference only.
 
Thermal (Contact ASE R&D for details.)
 
LQFP
Lead count

Pkgsize
(mm)

Padsize
(mil)

 Diesize
(mil)		 L/F material PCB layer JA (c/w)
0 (m/s) 1 (m/s) 2 (m/s)
32 7x7 150x150 100x100 Cu 4L 52.3 50 47.5
44 10x10 205x205 100x100 Cu 4L 48.4 46.2 43.8
44 10x10 275x275 213x158 Cu 4L 39.4 36.2 33.7
64 10x10 275x275 200x200 Cu 4L 37 35 32.6
80 10x10 240x240 115x150 Cu 4L 43.3 41.4 38.9
100 14x14 276x276 200x200 Cu 4L 39.7 37.7 35.4
100 14x14 354x354 200x200 Cu 4L 29.9 27.3 25.3
100 14x20 315x315 200x200 Cu 2L 43.8 39.8 36
100 14x20 315x315 200x200 Cu 4L 32.5 29.4 27.3
128 14x14 354x354 300x300 Cu 4L 28.5 26.5 24.2
144 20x20 276x276 200x200 Cu 4L 36.9 35.9 34.1
144 20x20 450x450 407x407 Cu 4L 23.2 21.3 19.4
160 24x24 354x354 200x200 Cu 4L 31.6 30.2 27.9
176 24x24 500x530 400x400 Cu 4L 20.3 17.8 16.3
208 28x28 405x405 200x200 Cu 4L 33.4 31.9 30.3
 
TQFP
Lead count Pkgsize
(mm)		 Padsize
(mil)		 Diesize
(mil)		 L/F material PCB layer JA (c/w)
0 (m/s) 1 (m/s) 2 (m/s)
64 10x10 210x210 200x200 Cu 4L 39.5 37 35.2
64 10x10 300x300 200x200 Cu 4L 35.3 32.7 30.5
64 14x14 200x200 100x100 Cu 4L 43.8 41.3 39.6
64 14x14 400x400 200x200 Cu 4L 30.4 27.8 25.9
80 12x12 240x240 200x200 Cu 4L 37.6 34.9 33.2
100 12x12 250x250 200x200 Cu 4L 39.7 37.4 35.1
100 14x14 180x180 100x100 Cu 4L 52.7 50.3 48.3
100 14x14 240x240 200x200 Cu 4L 37.9 34.6 32.8
100 14x14 354x354 200x200 Cu 4L 32.5 30.2 28.2
100 14x14 410x410 200x200 Cu 4L 30.2 27.9 25.7
128 14x14 354x354 300x300 Cu 4L 29.6 27.8 25.2
 
(1mm=39.37mil; 1mil=25.4um)
The above electrical data is for reference only.



Standard Process/Materials
 
LQFP/TQFP/Exposed Pad LQFP/Exposed Pad TQFP



Package Offering
 
The alphabetical notation refers to:
A1 Stand-off
A2 Body thickness
L1 Lead length
b Lead width
c L/F thickness
e Lead pitch
 
Overall thickness is the sum of A1 and A2.
 
LQFP/Exposed Pad LQFP (All units are in mm)
Body size Lead count A1 A2 L1 b c e
D1 E1
7 7 32 0.1 1.4 1 0.35 0.127 0.8
7 7 44 0.1 1.4 1 0.2 0.127 0.5
7 7 48 0.1 1.4 1 0.2 0.127 0.5
10 10 44 0.1 1.4 1 0.3 0.127 0.8
10 10 64 0.1 1.4 1 0.2 0.127 0.5
10 10 80 0.1 1.4 1 0.16 0.127 0.4
12 12 80 0.1 1.4 1 0.2 0.127 0.5
12 12 100 0.1 1.4 1 0.16 0.127 0.4
14 14 64 0.1 1.4 1 0.35 0.127 0.8
14 14 80 0.1 1.4 1 0.3 0.127 0.65
14 14 100 0.1 1.4 1 0.2 0.127 0.5
14 14 120 0.1 1.4 1 0.16 0.127 0.4
14 14 128 0.1 1.4 1 0.16 0.127 0.4
14 20 100 0.1 1.4 1 0.3 0.127 0.65
14 20 128 0.1 1.4 1 0.2 0.127 0.5
20 20 144 0.1 1.4 1 0.2 0.127 0.5
20 20 160 0.1 1.4 1 0.16 0.127 0.4
24 24 160 0.1 1.4 1 0.2 0.127 0.5
24 24 176 0.1 1.4 1 0.16 0.127 0.4
24 24 216 0.1 1.4 1 0.16 0.127 0.4
28 28 208 0.1 1.4 1 0.2 0.127 0.5
28 28 256 0.1 1.4 1 0.16 0.127 0.4
 
LQFP/Exposed Pad LQFP (All units are in mm)
Body size Lead count A1 A2 L1 b c e
D1 E1
10 10 44 0.1 1 1 0.3 0.127 0.8
10 10 64 0.1 1 1 0.2 0.127 0.5
12 12 80 0.1 1 1 0.2 0.127 0.5
12 12 100 0.1 1 1 0.16 0.127 0.4
14 14 100 0.1 1 1 0.2 0.127 0.5
14 14 128 0.1 1 1 0.16 0.127 0.4
20 20 176 0.1 1 1 0.16 0.127 0.4



Packing & Shipping
 
LQFP/Exposed Pad LQFP
 
TQFP/Exposed Pad TQFP



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