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QUAD  HQFP Product Overview   Heat spreader quad flat pack package (HQFP) uses a composite lead frame to increase heat dissipation. The die pad of HQFP is separate from the leads and enlarged to overlap with part of the leads. The function of this enlarged die pad is similar to the drop-in heat spreader, which is used to increase heat conduction area. HQFP allows about 50% increment in power dissipation compared to conventional QFP. Application   HQFP has higher power dissipation compared to conventional packages. It provides an economical method to upgrade the thermal performance of conventional QFP. HQFP enhances thermal performance compared with conventional packages without change in material and process. HQFP is the IC package of choice for ASICs, DSPs, micro-controllers and memory ICs, PLDs, high speed logic and other related technologies requiring better power management. Features   Real chip size High-speed data processing High density interconnection MCM assembly Reliability   Reliability data Visual inspection Open/Short test SAT inspection Temperature cycling -65°C~150°C/5 cycles Baking@125°C/24hours Moisture Soak: 30°C/60%RH/192 hours IR reflow: 220°C/3X Visual inspection Open/Short test SAT inspection Design Rule   Minimum sawing street width: 3mils(76um) Standard die thickness: 11~30 mils(280~762um) MCM die thickness: 9~11mils Minimum space between die edge to pad edge: 8mil and 30mil with ground bond MCM minimum space between top die edge to bottom die bond edge: 30mils Minimum bond pad pitch: 55um(in line) and 40um(staggered) Minimum bond pad open: 48um(in line) and 65um(staggered) Maximum wire length: 1.2mil diameter 200mils 1.0mil diameter 180mils 0.9mil diameter 160mils 0.8mil diameter 140mils   (1mm=39.37mil; 1mil=25.4um) Performance   Electrical   HQFP   The above electrical data is for reference only.   Thermal   HQFP     (1mm=39.37mil; 1mil=25.4um) The above electrical data is for reference only. Standard Process/Materials   HQFP Wafer mount   Wafer saw/Clean   2nd optical (Gate)   Die attach Epoxy: ABLESTIK 8360 Lead frame: C7025(Cu) Epoxy cure   Wire bond Gold wire: 99.99% Au 3rd optical (Gate)   Mold Compound: SUMITOMO EME-6600CS Laser backside marking   Dejunk/Trim   Post mold cure   Electrodeflash   Solder plating Solder: Sn/Pb=85/15 Top side marking White ink Visual/Mechanical inspection (Gate)   Form/Singulation   Final visual inspection (Gate)   Packing Bakeable thin tray   Optional process: wafer back grinding/die coating/top side laser marking/dry packing Pb Free   HQFP Die attach Epoxy: SUMITOMO 1076DS Wire bond Gold wire: 99.99% Au Mold Compound: SUMITOMO G700A Solder plating Solder: Sn/Cu Qual run status MSL2/260°C Pass Package Offering   The alphabetical notation refers to: A1 Stand-off A2 Body thickness L1 Lead length b Lead width c L/F thickness e Lead pitch   Overall thickness is the sum of A1 and A2.   HQFP (All units are in mm) Body size Lead count A1 A2 L1 b c e D1 E1 14 20 100 0.25 2.72 1.6/1.8/1.95 0.3 0.15 0.65 14 20 128 0.25 2.72 1.6/1.95/2.5 0.2 0.15 0.5 28 28 144 0.25 3.32 1.3/1.6/1.95 0.3 0.15 0.65 28 28 160 0.25 3.32 1.3/1.6/1.95 0.35 0.15 0.65 28 28 208 0.25 3.32 1.3/1.6/1.95 0.2 0.15 0.5 *All HQFP lead frames are made of copper Packing & Shipping   HQFP 2008 ASE Kaohsiung, All rights reserved. Terms of Use