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QUAD PLCC QFP LQFP/ TQFP HQFP Product Overview   Quad packages have been used for years in ASICs, DSPs, microcontrollers, and memory ICs. A wide range of open and close tools in quad packages offers low cost and reliable solutions for moderate and low pin ICs. Several state-of-the-art improvements on thermal and electrical issues concerning quad packages have been proposed, including MCM. To meet the requirements of compact and low profile electronic devices, quad packages as thin as 1.1mm are offered at ASE. Key Features   Pkg type PLCC PLCC plus HS QFP QFP plus HS LQFP LQFP plus exposed pad TQFP TQFP plus exposed pad HQFP   (1mm=39.37mil; 1mil=25.4um) * The overall thickness is the sum of body and stand-off. Reliability Test Plan   All the quad packages selected for temperature/humidity test and temperature cycles are subject to precondition process per JEDEC moisture LEVEL3 prior to environmental stress. The test criterion is zero defect out of 45 sampling units.   Temp/Humidity Test 85°C/ 85% RH, 1000 hr (JEDEC 22- A101) Pressure Cooker Test 121°C/ 100% RH/ 15 PSIG, 300 hr (JEDEC 22- A102) Temp Cyclic Test -65 ~ 150°C, 1000 CYCLES (MIL-STD-883-1010.7) High Temp Storage Test 150°C, 1000 hr (JEDEC 22- A103) High Accelerated Stress Test 130°C/ 85% RH/ 33.5 PSIA, 100 hr (JEDEC 22- A110) 2008 ASE Kaohsiung, All rights reserved. Terms of Use