| Product Overview |
| |
| PBGA is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm. |
|
| Application |
| |
| ASE's BGA design and features improve the performance of graphics, PLDs, DSPs, PC chipsets, communications, networking, microprocessors/controllers, ASIC, gate arrays and memory packages. |
|
| Features |
| |
| BGA is suitable for high power and high speed ICs requiring superb electrical and thermal enhancement. |
| |
 |
| |
 15x15 mm to 45x45 mm package
119 balls to 1520 ball count
High interconnect density
Low assembly cost
Self-alignment during reflow
Low profile
Ease of thermal and electrical management
Ease of routing
Good power dissipation
JEDEC MS-034 standard outlines
Pb free process available
Full In-house design capability |
|
| Reliability |
| |
| Package Level |
| |
| MSL |
JEDEC level 3 30°C/60% RH |
192 hours |
| TCT |
-65°C~150°C |
1000 cycles |
| HAST |
130°C/85% RH/33.5 PSIA |
96 hours |
| HTST |
150°C |
1000 cycles |
|
|
| Design Rule |
| |
 |
| |
| Description |
| A Package size |
| B Mold cap width/Length |
| C Max. finger to finger (Layout) |
| D Min. distance from wire to mold cap |
| E Max. looping heiqht |
| F Wafer thickness |
| G Package thickness |
| T Mold cap thickness |
|
| |
| Definition |
| A |
19x19 |
23x23 |
27x27 |
31x31 |
35x35 |
37.5x37.5 |
40x40 |
42.5x42.5 |
45x45 |
mm |
| B |
17x17 |
20x20 |
24x24 |
29x29 |
30x30 |
34.5x34.5 |
34.5x34.5 |
37x37 |
39x39 |
mm |
| C |
13.2 |
15.5 |
20 |
23.5 |
23.5 |
27.5 |
27.5 |
32 |
34 |
mm |
| D |
14 |
16.5 |
21 |
24.5 |
24.5 |
28.5 |
28.5 |
33 |
35 |
mm |
| E |
8 |
12 |
12 |
12 |
12 |
12 |
12 |
12 |
12 |
mil |
| F |
6 |
6 |
6 |
6 |
6 |
6 |
6 |
6 |
6 |
mil |
| G |
8 |
10 |
15 |
15 |
15 |
15 |
15 |
15 |
15 |
mil |
| H |
10 |
10 |
12 |
12 |
12 |
12 |
12 |
12 |
12 |
mil |
| T |
0.85 |
0.85 |
0.97 |
1.17 |
1.17 |
1.17 |
1.17 |
1.17 |
1.17 |
mm |
|
|
| Performance |
| |
| Electrical Characterization (Contact ASE R&D for details.) |
| |
PBGA ( 31X31mm) |
 |
|
|
| |
| PBGA (>31X31mm) |
 |
|
|
| |
| Metal Core Based PBGA |
 |
|
|
| |
| The above electrical data is for reference only. |
| |
| Thermal Characterization |
| |
| PBGA (31X31mm) |
 |
|
|
| |
| PBGA (>31X31mm) |
 |
|
|
| |
| The above thermal data is for reference only. |
|
| Standard Process/Materials |
| |
|
| |
| Optional process: wafer back grinding/die coating |
|
| Package Offering |
| |
 |
| The alphabetical notation refers to: |
| A Pkg overall thickness |
| A1 Stand-off |
| b Ball diameter |
| c Substrate thickness |
| e Ball pitch |
| |
| PBGA |
| Body size |
Lead count |
A1 |
A2 |
b |
c |
e |
| D1 |
E1 |
| 14 |
22 |
119/153 |
2.06 |
0.6 |
0.75 |
0.56 |
1.27 |
| 15 |
15 |
156/196 |
1.61 |
0.4 |
0.5 |
0.36 |
1 |
| 17 |
17 |
192/208/256 |
1.61 |
0.4 |
0.5 |
0.36 |
1 |
| 19 |
19 |
256~324 |
1.61 |
0.4 |
0.5 |
0.36 |
1 |
| 23 |
23 |
120~484 |
2.13 |
0.6/0.4 |
0.75/0.5 |
0.56 |
1.5/1.0 |
| 27 |
27 |
208~676 |
2.33 |
0.6/0.5 |
0.75/0.6 |
0.56 |
1.27/1.0 |
| 31 |
31 |
272~696 |
2.33 |
0.6/0.5 |
0.75/0.6 |
0.56 |
1.27/1.0 |
| 35 |
35 |
313~1156 |
2.33 |
0.6/0.5 |
0.75/0.6 |
0.56 |
1.27/1.0 |
| 37.5 |
37.5 |
388~901 |
2.33 |
0.6/0.5 |
0.75/0.6 |
0.56 |
1.27/1.0 |
| 40 |
40 |
400~956 |
2.33 |
0.6/0.5 |
0.75/0.6 |
0.56 |
1.27/1.0 |
| 42.5 |
42.5 |
560~1125 |
2.33 |
0.6/0.5 |
0.75/0.6 |
0.56 |
1.27/1.0 |
| 45 |
15 |
529~1520 |
2.33 |
0.6/0.5 |
0.75/0.6 |
0.56 |
1.27/1.0 |
|
|
| Packing & Shipping |
| |
| PBGA |
| Body size (mm) |
Row |
Column |
Total QTY |
Temp(°C) |
Vendor |
| 14x22 |
7 |
12 |
84 |
150 |
PEAK |
| 15x15 |
7 |
18 |
126 |
150 |
PEAK |
| 17x17 |
6 |
15 |
90 |
150 |
SHINON |
| 19x19 |
6 |
14 |
84 |
150 |
SHINON |
| 23x23 |
5 |
12 |
60 |
140 |
SHINON |
| 27x27 |
4 |
10 |
40 |
140 |
SHINON |
| 31x31 |
3 |
9 |
27 |
140 |
SHINON |
| 35x35 |
3 |
8 |
24 |
140 |
SHINON |
| 37.5x37.5 |
3 |
7 |
21 |
140 |
KO |
| 40x40 |
3 |
7 |
21 |
150 |
HS |
| 42.5x42.5 |
2 |
6 |
12 |
150 |
PEAK |
| 45x45 |
2 |
6 |
12 |
150 |
PEAK |
|
|
