| Product Overview |
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| Plastic ball grid array (PBGA) are BGA packages adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA has an overall thickness of over 1.7mm. |
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| Application |
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| ASE PBGA's design and features improve the performance of graphics, PLDs, DSPs, PC chipsets, communications, networking, microprocessors/controllers, ASIC, gate arrays and memory packages. |
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| Features |
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| BGA is suitable for high power and high speed ICs requiring superb electrical and thermal enhancement. |
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| 15x15 mm to 45x45 mm package |
| 119 balls to 1520 ball count |
| High interconnect density |
| Low assembly cost |
| Self-alignment during reflow |
| Low profile |
| Ease of thermal and electrical management |
| Ease of routing |
| Good power dissipation |
| JEDEC MS-034 standard outlines |
| Lead free process available |
| Full In-house design capability |
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| Reliability |
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| Package Level |
| Test Item |
Reference Standard |
Condition/Duration |
| MSL |
JEDEC 22-A103 |
Level 3, 30°C/60% RH, 192 hrs |
| TCT |
JEDEC 22-A104-B |
-65°C to 150°C, 500, 1000 cycles |
| HAST |
JEDEC 22-A118 |
130°C/85% RH, 33.5 psi 96 hrs |
| HTST |
JEDEC 22-A103-B |
150°C, 500/1000 hrs |
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