| Product Overview |
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| Heat slug BGA (HSBGA) is an upgraded type of PBGA. Within the molding area, a piece of copper heat slug is implanted. The heat slug is intended to lower the thermal resistance (JA) of PBGA without change of material. The JA of HSBGA is generally lower than PBGA by 20%, and achieves 5 to 6W of thermal dissipation under natural convection. This technology can be applied to any kinds of die-up substrates (e.g. 2-or 4-layer BT, and metal core). HSBGA is an excellent solution for cost-effective high power package, high-speed ICs like graphics chips, communication and networking ICs. |
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| Application |
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| HSBGA is excellent for devices that require improved thermal performance such as high power packages for high speed ICs in personal computers, networking, graphic ICs, data communications, consumer ICs and telecommunication applications. |
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| Features |
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 19x19 mm to 45x45 mm package available
256 balls to 1520 ball count available
Cost effective
Better electrical performance
Better thermal performance
Good power dissipation
JEDEC MS-034 standard outlines
Lead free process ready and available
Full In-house design capability
Full electrical and thermal characterization capability |
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| Reliability |
| |
| Package Level |
| MSL |
JEDEC level 3 30°C/60% RH |
192 hours |
| PCT |
121°C/100% RH/15 psig |
168 hours |
| TCT |
-65°C~150°C |
1000 cycles |
| HAST |
130°C/85% RH/33.5 PSIA |
96 hours |
| HTST |
150°C |
1000 cycles |
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| |
| Board Level |
| Temp cycle |
0 to 100°C; 2 cph with 10 minute ramps and 5 minute dwells respectively |
3500 cycles no failed |
| Shock |
1/2 Sine wave; 20G force; 3 drops per
direction per axis (18 drops per sample) |
No failed |
| Vibration |
Random vibration; 1.04 G RMS; 5-500HZ;
1 hour by 3 axis |
No failed |
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| Design Rule |
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| Description |
| A Package size |
| B Mold cap width/Length |
| C H/S explosure area |
| D Max. finger to finger (lavout) area |
| E H/S thickness |
| F Distance from wire to bottom of H/S |
| G Max. looping heiqht |
| H Wafer thickness |
| T Package thickness |
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| |
| Definition |
| A |
19x19 |
23x23 |
27x27 |
31x31 |
35x35 |
37.5x37.5 |
40x40 |
42.5x42.5 |
45x45 |
mm |
| B |
17x17 |
20x20 |
24x24 |
29x29 |
30x30 |
34.5x34.5 |
34.5x34.5 |
37x37 |
39x39 |
mm |
| C |
13.2 |
15.5 |
20 |
23.5 |
23.5 |
27.5 |
27.5 |
32 |
34 |
mm |
| D |
14 |
16.5 |
21 |
24.5 |
24.5 |
28.5 |
28.5 |
33 |
35 |
mm |
| E |
8 |
12 |
12 |
12 |
12 |
12 |
12 |
12 |
12 |
mil |
| F |
6 |
6 |
6 |
6 |
6 |
6 |
6 |
6 |
6 |
mil |
| G |
8 |
10 |
15 |
15 |
15 |
15 |
15 |
15 |
15 |
mil |
| H |
10 |
10 |
12 |
12 |
12 |
12 |
12 |
12 |
12 |
mil |
| T |
0.85 |
0.85 |
0.97 |
1.17 |
1.17 |
1.17 |
1.17 |
1.17 |
1.17 |
mm |
|
| |
| (1mm=39.37mil; 1mil=25.4um) |
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| Performance |
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| Electrical Characterization (Contact ASE R&D for details.) |
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| Electrical |
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| HSBGA |
 |
|
|
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| The above electrical data is for reference only. |
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| Thermal |
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| HSBGA (Data marked with "s"are derived from simulation.) |
 |
|
|
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| The above thermal data is for reference only. |
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| Standard Process/Materials |
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|
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| Optional process: wafer back grinding/die coating |
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| Package Offering |
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| The alphabetical notation refers to: |
| A Pkg overall thickness |
| A1 Stand-off |
| b Ball diameter |
| c Substrate thickness |
| e Ball pitch |
| |
| HSBGA |
| Body size |
Ball count |
A |
A1 |
b |
c |
e |
| D1 |
E1 |
| 19 |
19 |
256~324 |
1.61/1.81 |
0.4 |
0.5 |
0.36/0.56 |
1.0 |
| 23 |
23 |
120~484 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 27 |
27 |
120~484 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 31 |
31 |
272~696 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 35 |
35 |
313~1156 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 37.5 |
37.5 |
388~901 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 40 |
40 |
400~956 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 42.5 |
42.5 |
560~1125 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 45 |
45 |
529~1520 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
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| Packing & Shipping |
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| HSBGA |
| Body size (mm) |
Row |
Column |
Total QTY |
Temp(°C) |
Vendor |
| 19x19 |
6 |
14 |
84 |
150 |
SHINON |
| 23x23 |
5 |
12 |
60 |
150 |
PEAK |
| 27x27 |
4 |
10 |
40 |
150 |
HS |
| 31x31 |
3 |
9 |
27 |
150 |
SHINON |
| 35x35 |
3 |
8 |
24 |
140 |
HS |
| 37.5x37.5 |
3 |
7 |
21 |
140 |
CAMTE |
| 40x40 |
3 |
7 |
21 |
140 |
PEAK |
| 42.5x42.5 |
3 |
6 |
18 |
140 |
PEAK |
| 45x45 |
2 |
6 |
12 |
140 |
PEAK |
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