| Product Overview |
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| Side by side MCM PBGA and side by side MCM HSBGA are the types of MCMs offered by ASE. MCM HSBGA includes multi heat slug for heat dissipation in different die layout (square, trapezoid and eclipse). |
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| Application |
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| PC: |
| Chipset, Graphics and Memory |
| |
| Consumer: |
| Game console, Set top box |
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| Communication: |
| PDA, Bluetooth modules |
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| Features |
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 23x23 mm to 45x45 mm body size
Full in-house design capability
Fine Pitch wirebond capability
Pb free process ready and available
High speed performance
Good thermal performance
Different devices integrated onto one package
Cost effective solution for high density package
Eliminate the use of second level package
Good electrical performance
JEDEC standard compliant |
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| Reliability |
| |
| Package Level |
| MSL |
JEDEC level 3, 30°C/60% RH |
192 hours |
| PCT |
121°C/100% RH/2 atm |
168 hours |
| TCT |
-65°C~150°C |
1000 cycles |
| HAST |
130°C/85%RH/33.5 PSIG |
96 hours |
| HTST |
150°C |
1000 hours |
|
| |
| Board Level |
| TCT |
-40~125°C |
2000 cycles no failed |
| THT |
85°C/85% RH |
1000 cycles no failed |
| Vibration test |
4 times of vibration for each axis |
No failed |
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| Design Rule |
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 |
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| (1mm=39.37mil; 1mil=25.4um) |
| Remark 1: ASE standard rule for gold wire dia. and wire length |
| Remark 2: PBGA design rule for die thickness |
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| Performance |
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| Electrical Characterization (Contact ASE R&D for details.) |
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| Thermal Characterization (Refer to PBGA.) |
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| Standard Process/Materials |
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| Package Offering |
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| The alphabetical notation refers to: (All units are in mm.) |
| A Pkg overall thickness |
| A1 Stand-off |
| b Ball diameter |
| c Substrate thickness |
| e Ball pitch |
| |
| MCM BGA |
| Body size |
Ball count |
A |
A1 |
b |
c |
e |
| D1 |
E1 |
| 23 |
23 |
120~484 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 27 |
27 |
208~676 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 31 |
31 |
272~696 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 35 |
35 |
313~1156 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 37.5 |
37.5 |
388~901 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 40 |
40 |
400~956 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 42.5 |
42.5 |
560~1125 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 45 |
45 |
529~1520 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
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| Packing & Shipping |
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| Body size (mm) |
Row |
Column |
Total QTY |
Max. temp(°C) |
Vendor |
| 23x23 |
5 |
12 |
60 |
150 |
PEAK |
| 27x27 |
4 |
10 |
40 |
150 |
HS |
| 31x31 |
3 |
9 |
27 |
150 |
SHINON |
| 35x35 |
3 |
5 |
24 |
150 |
HS |
| 37.5x37.5 |
3 |
7 |
21 |
150 |
CAMTE |
| 40x40 |
3 |
7 |
21 |
150 |
PEAK |
| 42.5x42.5 |
3 |
6 |
18 |
150 |
PEAK |
| 45x45 |
2 |
6 |
12 |
150 |
PEAK |
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