| Product Overview |
| |
ASE offers stacked chip scale package (SCSP) and stacked quad flat package (SQFP) that combines BGA and leadframe package solutions onto each MCM type. Stacked CSP is the most popular package solution for flash & SRAM combination.
Another exclusive stacked die package offered by ASE is the Sandwich SCSP. This unique package combines up to 4 dice stacked on top of another with one of the dice acting as a spacer in between. For more information on how Sandwich SCSP can solve your packaging problems, contact ASE R&D. |
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| Application |
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The integration of several semiconductor technologies into single MCM BGA package offers excellent advantages for many applications where size; weight; electrical performance and board density are important considerations.
Stacked CSP/QFP is suitable for chip applications in cellular phones, PDA and various handheld electronics. Sandwich SCSP is suitable for applications in memory cards and also handheld electronics. |
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| Features |
| |
 23x23 mm to 45x45 mm body size available
Full in-house design capability
Fine Pitch wirebond capability
Pb free process available
High speed performance
Good thermal performance
Different devices integrated onto one package
Cost effective solution for high density package
Eliminate the use of second level package
Good electrical performance
JEDEC standard compliant |
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| Reliability |
| |
| Package Level |
| MSL |
JEDEC level 3, 30°C/60% RH |
192 hours |
| PCT |
121°C/100% RH/2 atm |
168 hours |
| TCT |
-65°C~150°C |
1000 cycles |
| HAST |
130°C/85%RH/33.5 PSIG |
96 hours |
| HTST |
150°C |
1000 hours |
|
| |
| Board Level |
| TCT |
0~100°C, 2 CPH W/10 minute ramps and 5 minute duells respectively |
3500 cycles no failure |
| THT |
85°C/85% RH |
1000 cycles no failed |
| Vibration Test |
4 times of vibration for each axis |
No failed |
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|
| Design Rule |
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 |
| |
| 1 |
Pkg size |
27x27~45x45 |
23x23 |
15x15~19x19 |
15x15~19x19 |
mm |
| 2 |
Molding cap thickness |
1.17 |
0.97 |
0.85 |
0.54 |
mm |
| 3 |
Die thickness |
11~16 |
9~11 |
7~9 |
5~7 |
mil |
| 4 |
Max. wire loop height |
12 |
12 |
12 |
4 |
mil |
|
| |
| Item |
Description |
Dimension |
unit |
| D |
Top die edge to bottom
die bond pad edge |
15 min |
15 min |
15 min |
15 min |
mil |
| G |
Distance of fingers
(Finger to die ddge) |
min.25 |
min.25 |
max.160~240* |
max.160~240* |
mil |
| P |
Finger pitch for top wire |
min.300 |
min.300 |
min.300 |
min.300 |
um |
|
| |
| (1mm=39.37mil; 1mil=25.4um) |
Remark: 1. If "D" was less than 12 mils, the sandwich package design rule is applicable.
 2. Side by side MCM BGA rule is applicable.
3. ASE standard rule for gold wire dia and wire length. |
| |
 |
| |
|
| |
| (1mm=39.37mil; 1mil=25.4um) |
| Remark: 1. ASE standard rule for gold wire dia. and wire length. |
| |
 |
| |
| D3 Upper function die |
| E3 Non-conductive epoxy layer (QMI536) |
| D2 Middle3 Dummy Die |
| E2 Non-conductive epoxy (QMI536) layer |
| D1 Bottom function die |
| E1 Conductive epoxy (2100A) layer |
| H Wire loop height |
| T Mold cap thickness |
| |
| Item |
Dimension |
Unit |
| Pkg size |
15~19 |
23 |
27~45 |
mm |
| T |
33.5 |
38 |
46 |
mil |
| D1 |
5~7 |
max. 10 |
max. 10 |
mil |
| E1 |
0.5~2 |
0.5~2 |
0.5~2 |
mil |
| D2 |
max. 6 |
max. 6 |
max. 10 |
mil |
| E2 |
0.5~2 |
0.5~ |
0.5~2 |
mil |
| D3 |
5~7 |
max. 10 |
max. 10 |
mil |
| E3 |
0.5~2 |
0.5~2 |
0.5~2 |
mil |
| H |
max. 5 |
max. 6 |
max. 6 |
mil |
|
|
| Performance |
| |
| Electrical Characterization (Contact ASE R&D for details.) |
| |
| Thermal Characterization (Refer to PBGA.) |
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| Standard Process/Materials |
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| Package Offering |
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 |
| The alphabetical notation refers to: (All units are in mm.) |
| A Pkg overall thickness |
| A1 Stand-off |
| b Ball diameter |
| c Substrate thickness |
| e Ball pitch |
| D1 Width |
| E1 Length |
| |
| MCM BGA |
| Body size |
Ball count |
A |
A1 |
b |
c |
e |
| D1 |
E1 |
| 23 |
23 |
120~484 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 27 |
27 |
208~676 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 31 |
31 |
272~696 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 35 |
35 |
313~1156 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 37.5 |
37.5 |
388~901 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 40 |
40 |
400~956 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 42.5 |
42.5 |
560~1125 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 45 |
45 |
529~1520 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
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| Packing & Shipping |
| |
| Body size (mm) |
Row |
Column |
Total QTY |
Max. temp(°C) |
Vendor |
| 23x23 |
5 |
12 |
60 |
150 |
PEAK |
| 27x27 |
4 |
10 |
40 |
150 |
HS |
| 31x31 |
3 |
9 |
27 |
150 |
SHINON |
| 35x35 |
3 |
5 |
24 |
150 |
HS |
| 37.5x37.5 |
3 |
7 |
21 |
150 |
CAMTE |
| 40x40 |
3 |
7 |
21 |
150 |
PEAK |
| 42.5x42.5 |
3 |
6 |
18 |
150 |
PEAK |
| 45x45 |
2 |
6 |
12 |
150 |
PEAK |
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