| Product Overview |
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The need for high density, high performance and cost effectiveness has sped up the deve-lopment and application of the multi-chip module (MCM). This type of package allows the integration of different chip functions onto mini-substrates instead of placing individual packages onto a large PCB (or so-called second level package).
ASE's Multi-Chip Module Ball Grid Array (MCM BGA) assembly employs the latest IC packaging technology for high-density products. The electrical, thermal performance and the cost effectiveness of the MCM BGA package enable system designers to integrate several devices onto a single IC package. |
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| Application |
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| The integration of several semiconductor technologies onto a MCM BGA package offers excellent advantages for many applications where size, weight, electrical performance and board density are crucial factors. The high-speed performance and improved thermal capability of the MCM BGA package are excellent for personal computing, networking, graphic IC, data communication, consumer IC, telecommunication, analog/digital, bipolar/CMOS, ASIC and memory applications. |
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| Features |
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 23x23 mm to 45x45 mm body size
Full in-house design capability
Fine Pitch wirebond capability
Pb free process available
High speed performance
Good thermal performance
Different devices integrated onto one package
Cost effective solution for high density package
Eliminate the use of second level package
Good electrical performance
JEDEC standard compliant |
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| Reliability |
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| Package Level |
| MSL |
JEDEC level 3, 30°C/60% RH |
192 hours |
| PCT |
121°C/100% RH/2 atm |
168 hours |
| TCT |
-65°C~150°C |
1000 cycles |
| HAST |
130°C/85%RH/33.5 PSIG |
96 hours |
| HTST |
150°C |
1000 hours |
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| Board Level |
| MSL |
JEDEC level 3, 30°C/60% RH |
192hours |
| THT |
85°C85% RH |
1000 hours |
| Vibration test |
4 times of vibration for each axis |
No failed |
| TCT |
0~100°C, 2 CPH W/10 minute ramps and 5 minute duells respectively |
3500 cycles no failure |
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| Design Rule |
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| (1mm=39.37mil; 1mil=25.4um) |
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| Performance |
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| Electrical Characterization (Contact ASE R&D for details.) |
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| Thermal Characterization (Refer to PBGA.) |
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| Standard Process/Materials |
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| Package Offering |
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| The alphabetical notation refers to: (All units are in mm.) |
| A Pkg overall thickness |
| A1 Stand-off |
| b Ball diameter |
| c Substrate thickness |
| e Ball pitch |
| D1 Width |
| E1 Length |
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| MCM BGA |
| Body size |
Ball count |
A |
A1 |
b |
c |
e |
| D1 |
E1 |
| 23 |
23 |
120~484 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 27 |
27 |
208~676 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 31 |
31 |
272~696 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 35 |
35 |
313~1156 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 37.5 |
37.5 |
388~901 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 40 |
40 |
400~956 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 42.5 |
42.5 |
560~1125 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
| 45 |
45 |
529~1520 |
2.23/2.33 |
0.5/0.6 |
0.6/0.75 |
0.56 |
1.0/1.27 |
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| Packing & Shipping |
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| MCM BGA |
| Body size (mm) |
Row |
Column |
Total QTY |
Max. temp(°C) |
Vendor |
| 23x23 |
5 |
12 |
60 |
150 |
PEAK |
| 27x27 |
4 |
10 |
40 |
150 |
HS |
| 31x31 |
3 |
9 |
27 |
150 |
SHINON |
| 35x35 |
3 |
5 |
24 |
150 |
HS |
| 37.5x37.5 |
3 |
7 |
21 |
150 |
CAMTE |
| 40x40 |
3 |
7 |
21 |
150 |
PEAK |
| 42.5x42.5 |
3 |
6 |
18 |
150 |
PEAK |
| 45x45 |
2 |
6 |
12 |
150 |
PEAK |
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