ASE Kaohsiung

BGA Low & Thin TFBGA

Product Overview

TFBGA is an ideal solution to the requirements of both dense layout and small outline for ICs of I/O counts of less than 329. Four-layer BT substrates are available for these packages to provide better electrical characteristics. TFBGA technology was developed for space reduction. This type of package has chip size solution based on mature laminated substrate technology and material.

Application

TFBGA are suitable for high-performance ICs like flash, SRAM, DSP Memory, Communi-cation ICs and RFICs. Common application of TFBGA are computing and communication products such as PDA, notebooks, memory cards, cell phones, mobile stations and wireless systems.

Features

Maximum package size: 18x18 mm

Minimum package size: 5x5 mm

0.5 mm ball pitches available

JEDEC level 2A reliability

Memory assembly available

MCM package available

Pb free package available

Reliability

Package Level of Regular BOM (240°C)
MSL	JEDEC level 2A & 240°C, 60°C/60% RH	120 hours
PCT	121°C/100% RH/15 psig	168 hours (Jedec 22-A102)
TCT	-65°C~150°C	1000 cycles (MIL-STD-883)
HTST	150°C	1000 cycles (Jedec 22-A103-A)
HAST	130°C/85% RH/33.5 PSIA	96 hours (Jedec 22-A118)
THT	80°C/85% RH	1000 cycles (Jedec 22-A108)

Package Level of PB Free BOM (260°C)
MSL	JEDEC level 3 & 260 & deg;C, 30°C/60% RH	192 hours
PCT	121°C/100% RH/15 psig	168 hours (Jedec 22-A102)
TCT	-65°C~150°C	1000 cycles (MIL-STD-883)
HTST	150°C	1000 cycles (Jedec 22-A103-A)
HAST	130°C/85%	96 hours (Jedec 22-A118)
THT	80°C/85% RH	1000 cycles (Jedec 22-A108)

Design Rule

Package size (A)	18x18 mm Max.
Finger edge to substrate edge	100 um Min.
Max wire length (C)	140 mils (3556 um) Max.
Wire diameter (D)	1.0 mil
Die edge to finger edge (E)	17 mils (431 um) Min.
Saw street (F)	0.3 mm

(1mm=39.37mil; 1mil=25.4um)

Performance

Electrical

TFBGA
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Thermal

TFBGA
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Standard Process/Materials

TFBGA
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Package Offering

A PKG overall thickness

A1 Stand-off

b Ball diameter

c Substrate thickness

e Ball pitch

D1 Pkg size

E1 Pkg size

T(F)BGA
Body size		Ball count	A (Maximum)	A1	b	c	e
D1	E1	Ball count	A (Maximum)	A1	b	c	e
6	6	84	1.2	0.2	0.3	0.36	0.5
6	8	36/48	1.2	0.2	0.3	0.36	0.75
6	9	48	1.2	0.2	0.3	0.36	0.8
7	7	36/48	1.2	0.2	0.3	0.36	0.75/0.8
7	12	48	1.2	0.2	0.3	0.36	0.75
8	8	64/80	1.2	0.2	0.3	0.26	0.8
8	9	48	1.2	0.2	0.3	0.36	0.8
8	10	48	1.2	0.2	0.3	0.36	0.75/0.8
8	14	48/63	1.2	0.2	0.3	0.36	0.75/0.8
10	13	64	1.2/1.4	0.4	0.4/0.5	0.36	1
11	12	63	1.2	0.2	0.3	0.36	0.8
12	12	144	1.2	0.2	0.3	0.26	0.8
13	13	144	1.2/1.4	0.4	0.4/0.5	0.36	0.8/1
13	15	165	1.2/1.4	0.4	0.4/0.5	0.36	1
15	15	233	1.2/1.4	0.4	0.4/0.5	0.36	0.8
18	18	329	1.2/1.4	0.4	0.4/0.5	0.26	0.8

Packing & Shipping

T(F)BGA
Body size (mm)	Row	Column	Total QTY	Temp(°C)	Vendor
6X8	16	30	480	150	SHINON
7X7	13	32	416	150	PEAK
6X9	16	28	448	140	DAEWON
8X8	12	30	360	140	DAEWON
8X9	12	28	336	150	SHINON
8X14	11	18	198	140	DAEWON
10X13	8	18	144	180	DAEWON
13X13	8	20	160	150	KOSTAT
15X15	7	18	126	140	DAEWON
18X18	6	14	84	150	SHINON

Package sizes vary by customer request and substrate design.