ASE Kaohsiung

BGA Low & Thin LFBGA

Product Overview

Low & Thin BGA is an ideal solution to meet requirements of both dense layout and small outline for ICs of I/O counts of less than 288. Four-layer BT substrates are available for these packages to provide better electrical characteristics. Low & Thin BGA was developed for space reduction. This type of package is a chip size solution based on mature laminated substrate technology and material.

Application

Low & Thin BGAs are suitable for high-performance ICs like flash, SRAM, DSP memory, communication ICs and RFICs. Common applications of Low & Thin BGA are computering and communication products, such as PDA, notebooks and memory cards, cell phones, mobile stations and wireless systems.

Features

Maximum package size: 19x19 mm

0.5 mm ball pitches available

JEDEC level 2A reliability

Fine pitch technology development

MCM package available

Pb free package available

Reliability

Package Level

Package Level of Regular BOM (240°C)
MSL	JEDEC level 2A & 240°C, 60°C/60% RH	120 hours
PCT	121°C/100% RH/15 psig	168 hours (Jedec 22-A102)
TCT	-65°C~150°C	1000 cycles (MIL-STD-883)
HTST	150°C	1000 cycles (Jedec 22-A103-A)
HAST	130°C/85% RH/33.5 PSIA	96 hours (Jedec 22-A118)
THT	80°C/85% RH	1000 cycles (Jedec 22-A108)

Package Level of PB Free BOM (260°C)
MSL	JEDEC level 3 & 260 & deg;C, 30°C/60% RH	192 hours
PCT	121°C/100% RH/15 psig	168 hours (Jedec 22-A102)
TCT	-65°C~150°C	1000 cycles (MIL-STD-883)
HTST	150°C	1000 cycles (Jedec 22-A103-A)
HAST	130°C/85%	96 hours (Jedec 22-A118)
THT	80°C/85% RH	1000 cycles (Jedec 22-A108)

Design Rule

Package size (A)	19x19 mm Max.
Finger edge to substrate edge	100 um Min.
Max wire length (C)	140 mils (3556 um) Max.
Wire diameter (D)	1.0 mil
Die edge to finger edge (E)	17 mils (431 um) Min.
Saw street (F)	0.3 mm

(1mm=39.37mil; 1mil=25.4um)

Performance

Electrical

LFBGA
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Thermal

LFBGA
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Standard Process/Materials

HSBGA
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Package Offering

D1, E1 Pkg size

A PKG overall thickness

A1 Stand-off

b Ball diameter

c Substrate thickness

e Ball pitch

L(F)BGA
Body size		Lead count	A	A1	b	c	e
D1	E1	Lead count	A	A1	b	c	e
8	8	64/80	1.4	0.3	0.4	0.26	0.8
10	10	100	1.4	0.3	0.4	0.26	0.8
12	8	66	1.4	0.3	0.4	0.26	0.8
12	12	180	1.4	0.3	0.4	0.26	0.8
13	13	144/176	1.4	0.3	0.4	0.26	0.8
15	15	156~233	1.4	0.3	0.4	0.26	0.8
11	11	100	1.7	0.4	0.5	0.36	1
13	13	144	1.7	0.4	0.5	0.36	1
15	15	172/176	1.7	0.4	0.5	0.36	1
17	17	192~256	1.7	0.4	0.5	0.36	1
18	18	320	1.7	0.4	0.5	0.36	1
19	19	256	1.7	0.4	0.5	0.36	1

Package sizes vary by customer request and substrate design.

Packing & Shipping

LFBGA
Body size (mm)	Row	Column	Total QTY	Temp(°C)	Vendor
8x8	12	30	360	140	DAEWON
13x13	8	20	160	150	KOSTAT
15x15	7	18	126	165	DAEWON
17x17	6	15	90	150	PEAK
19x19	6	14	80	140	DAEWON