| Product Overview |
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| Using polyimide-based films, Film BGA provides better line/space wiring capabilities as narrow as 1/1 mil. Through ever-flexible routing topology in fan-in or fan-out, Film BGA provides denser traces to implement chip-scale packaging. Due to lack of adequate layer-to-layer adhesions, only a single copper layer of Film BGA is available as of now. Film BGA is suitable for the lower or moderate pin count ICs (<300 I/O). |
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| Application |
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| With higher pin count, small footprint and thin package, Film BGA provides a good solution for telecommunication and portable products such as cellular phones (GSM/CDMA), bluetooth, digital video/still camera, set up box, ASIC, DSP, flash and pagers. |
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| Features |
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 Small footprint
Low profile
Light weight
JEDEC standard outline |
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| Reliability |
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| Package Level |
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| Moisture sensitivity |
JEDEC Level 3, 30°C/ 60% RH |
192 hours |
| Autoclave |
121°C/ 100% RH/ 2 atm |
168 hours |
| Temp cycle |
–65°C ~ 150°C |
1000 cycles |
| High temp storage |
150°C |
1000 hours |
| Thermal shock |
-65°C ~ +150°C |
1000 cycles |
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| Board Level |
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| Thermal |
-40°C ~ +125°C, 1 cycle/hour |
1000 cycles |
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| Performance |
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| Electrical |
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| Film BGA |
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Ball count
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Pkg Size(mm) |
| 112 |
10X10 |
| 144 |
12X12 |
| 180 |
12X12 |
| 280 |
16X16 |
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| Thermal |
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Film BGA (data marked with “s” are derived from simulation)
| Ball count |
Pkg size(mm) |
Pitch (mm) |
Pad size (mil) |
Die size (mil) |
Substrate layer |
qJA (c/w) |
Remark |
| 0 (m/s) |
1 (m/s) |
2 (m/s) |
| 112 |
10X10 |
0.8 |
345X345 |
305X305 |
1 |
24.1 |
22 |
20.1 |
s |
| 144 |
12X12 |
0.8 |
416X416 |
100X100 |
1 |
120.4 |
116.7 |
113.2 |
- |
| 144 |
12X12 |
0.8 |
416X416 |
200X200 |
1 |
35.7 |
33.2 |
31.5 |
- |
| 144 |
12X12 |
0.8 |
416X416 |
300X300 |
1 |
24.5 |
22.4 |
20.9 |
- |
| 180 |
12X12 |
0.8 |
- |
393X393 |
1 |
21.8 |
19.4 |
17.6 |
s |
| 208 |
15X15 |
0.8 |
- |
491X491 |
1 |
19.9 |
17.4 |
15.4 |
s |
| 208 |
16X16 |
0.8 |
- |
268X272 |
1 |
53.1 |
50 |
46.9 |
s |
| 280 |
16X16 |
0.8 |
- |
423X423 |
1 |
21.6 |
19.3 |
17.5 |
s |
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| Standard Process/Materials |
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Film BGA
| Wafer Mount |
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| Wafer Saw/ Clean |
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| 2nd Optical (Gate) |
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| Die Attach |
EPOXY: QMI 536 (NON-CONDUCTIVE)SUBSTRATE: POLYIMIDE |
| Die Attach Cure |
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| Plasma Clean |
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| Wire Bond |
GOLD WIRE: 99.99% Au |
| 3rd Optical (Gate) |
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| Plasma Clean |
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| Mold |
COMPOUND: PLASKON SMT-B-1 Series |
| Top Side Laser Marking |
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| Post Mold Cure |
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| Solder Ball Mount |
SOLDER BALL: Sn/ Pb=63/ 37 |
| Flux Clean |
FLUX: WATER SOLUBLE |
| Singulation |
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| FINAL Visual INSPECTION (GATE) |
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| Packing |
BAKEABLE JEDEC TRAY |
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| Optional process: wafer back grinding / dry packing |
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| Design Guideline |
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Film BGA
| Pkg size |
Ballcount |
A |
A1 |
b |
c |
e |
| D1 |
E1 |
| 10 |
10 |
112 |
1.1 |
0.4 |
0.45 |
0.11 |
0.8 |
| 12 |
12 |
132/144/180 |
1.1 |
0.4 |
0.45 |
0.11 |
0.8 |
| 15 |
15 |
208 |
1.1 |
0.4 |
0.45 |
0.11 |
0.8 |
| 16 |
16 |
280 |
1.1 |
0.4 |
0.45 |
0.11 |
0.8 |
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| Package Offering |
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Film BGA
| Pkg size (mm) |
Row |
Column |
Total QTY |
Temp |
Vendor |
| 10X10 |
10 |
25 |
250 |
140 |
DAEWON |
| 12X12 |
8 |
21 |
168 |
140 |
CAMTEX |
| 15X15 |
7 |
18 |
126 |
140 |
DAEWON |
| 16X16 |
7 |
17 |
119 |
140 |
DAEWON |
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