| Product Overview |
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| Low & thin BGAs make their appearance as the best solution to the requirements of both dense layout and small outline for ICs of moderate I/O count (less than 300). Low & Thin BGAs are very suitable for high-performance ICs, like DSP, memory, communication ICs, and RFICs. According to the package definition of JEDEC Standard No. 95-1, low & thin BGAs are classified by the ball pitch (B) and the package thickness (A). They are: |
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A<=1.0 |
1<A<=1.2 |
1.2<A<=1.7 |
| B<=0.8 |
VFBGA |
TFBGA |
LFBGA |
| B>0.8 |
VBGA |
TBGA |
LBGA |
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| All units are in mm |
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