| Product Overview |
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Cavity-down thermally enhanced BGAs are the solution to thermal dissipation requirements over 6W. All cavity-down BGAs have the chip seated onto the copper heat sink to conduct the heat. This method desensitizes the performance deviation out of the chip size, and lowers the thermal resistance of junction-to-case ( JC), which makes the external heat sink or fan work more effectively.
Cavity-down BGAs enhance thermal performance about 15~20% as compared to 4-layer PBGA and 35% for 2-layer PBGA. Electrical performance of cavity-down BGAs is significant as well. The reason is attributed to their flexible layout for staggered traces on different layers, shorter vias and better shielding effect out of the copper heat sink. With the heat sink covering the signal traces fully, cavity-down BGAs provide better resistance to external EMI (electro-magnetic interference) noise. |
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| Application |
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| Thermally enhanced package design extensive application includes high-speed, high-power semiconductors, such as ASICs, Micro processors, Gate Arrays and DSPs. CS BGA market covers telecom/cellular, laptops/sub-notebooks, PDAs, VME CPU/BUS boards, video GUI and wireless. |
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| Features |
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 Superior thermal performance (>6W)
Superior electrical performance
JEDEC MO-192 standard outlines |
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 |
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| Reliability |
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| Package Level |
| MSL |
JEDEC level 3, 30°C/60% RH |
192 hours |
| PCT |
121°C/100% RH/2 atm |
168 hours |
| TCT |
-65°C~150°C |
1000 cycles |
| HAST |
130°C/85% RH |
100 hours |
| HTST |
150°C |
1000 hours |
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| Design Rule |
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L(F)BGA
| Pkg size |
Ball count |
A |
A1 |
b |
c |
e |
| D1 |
E1 |
| 8 |
8 |
64/80 |
1.3/1.4 |
0.3 |
0.4 |
0.26 |
0.8 |
| 10 |
8 |
66 |
1.3/1.4 |
0.3 |
0.4 |
0.26 |
0.8 |
| 10 |
10 |
100 |
1.3/1.4 |
0.3 |
0.4 |
0.26 |
0.8 |
| 12 |
8 |
66 |
1.3/1.4 |
0.3 |
0.4 |
0.26 |
0.8 |
| 12 |
12 |
180 |
1.3/1.4 |
0.3 |
0.4 |
0.26 |
0.8 |
| 13 |
8 |
69 |
1.3/1.4 |
0.3 |
0.4 |
0.26 |
0.8 |
| 13 |
13 |
144/176 |
1.3/1.4 |
0.3 |
0.4 |
0.26 |
0.8 |
| 14 |
8 |
66 |
1.3/1.4 |
0.3 |
0.4 |
0.26 |
0.8 |
| 15 |
15 |
156~ 233 |
1.3/1.4 |
0.3 |
0.4 |
0.26 |
0.8 |
| 11 |
11 |
100 |
1.3/1.6 |
0.4 |
0.5 |
0.36 |
1 |
| 13 |
13 |
144 |
1.3/1.6 |
0.4 |
0.5 |
0.36 |
1 |
| 15 |
15 |
172/176 |
1.3/1.6 |
0.4 |
0.5 |
0.36 |
1 |
| 17 |
17 |
192~ 256 |
1.3/1.6 |
0.4 |
0.5 |
0.36 |
1 |
| 18 |
18 |
320 |
1.3/1.6 |
0.4 |
0.5 |
0.36 |
1 |
| 19 |
19 |
256/288 |
1.3/1.6 |
0.4 |
0.5 |
0.36 |
1 |
| 21 |
21 |
400 |
1.3/1.6 |
0.4 |
0.5 |
0.36 |
1 |
| 23 |
23 |
484 |
1.3/1.6 |
0.4 |
0.5 |
0.36 |
1 |
| 27 |
27 |
676 |
1.3/1.6 |
0.4 |
0.5 |
0.36 |
1 |
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| * Two mold thickness, 0.53/ 0.7 |
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| Performance |
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| Electrical |
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| Ball Count |
Pkg Size (mm) |
Pitch (mm) |
Pad Size (mil) |
Die Size (mil) |
Substrate layer |
qJA (c/w) |
Remark |
| 0 (m/s) |
1 (m/s) |
2 (m/s) |
| 256 |
27X27 |
1.27 |
460X460 |
394X394 |
3 |
13.6 |
11.5 |
10 |
s |
| 352 |
35X35 |
1.27 |
531X531 |
200X200 |
3 |
12.9 |
10.6 |
9 |
- |
| 352 |
35X35 |
1.27 |
531X531 |
400X400 |
3 |
11.7 |
9.2 |
7.8 |
- |
| 432 |
40X40 |
1.27 |
531X531 |
350X350 |
3 |
11.5 |
8.5 |
7.3 |
s |
|
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| Thermal |
| |
| L(F)BGA (data marked with “s” are derived from simulation) |
| Ballcount |
| 256 |
| 352 |
| 352 |
| 520 |
|
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| Standard Process/Materials |
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| Wafer Mount |
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| Wafer Saw/ Clean |
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| 2nd Optical (Gate) |
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| Die Attach |
EPOXY: QMI 505 MT |
| Die Attach Cure |
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| Plasma Clean |
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| Wire Bond |
GOLD WIRE: 99.99% Au |
| 3rd Optical (Gate) |
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| Plasma Clean |
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| Encapsulate |
LIQUID ENCAPSULANT: HYSOL FP4450(HF)
FOR FILL & HYSOL FP4451 FOR DAM |
| Debubble |
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| Post Cure |
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| Solder Ball Mount |
SOLDER BALL: Sn/ Pb=63/ 37 |
| Flux Clean |
FLUX: WATER SOLUBLE |
| Top Side Marking |
BLACK INK |
| Ink Cure |
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| Final Visual Inspection (Gate) |
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| Packing |
BAKEABLE JEDEC TRAY |
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| Optional process: wafer back grinding / dry packing |
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| Design Guideline |
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| Packaging Capability & Outline Dimension |
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| The alphabetical notation means |
| A PKG Overall Thickness |
| A1 Stand-off |
| b Ball diameter |
| c Substrate thickness |
| e Ball pitch |
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| A1 in the cavity-down BGA is from the bottom of solder ball to the bottom of encapsulation. |
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| ViperBGA/ L2 BGA/ CSBGA/ Tape BGA ( all units are in mm ) |
| Pkg size |
Ball count |
A |
A1 |
b |
c |
e |
| D1 |
E1 |
| 27 |
27 |
256 |
1.70 |
0.1 min. |
0.75 |
1.10 |
1.27 |
| 31 |
31 |
304 |
1.70 |
0.1 min. |
0.75 |
1.10 |
1.27 |
| 35 |
35 |
352 |
1.70 |
0.1 min. |
0.75 |
1.10 |
1.27 |
| 37.5 |
37.5 |
400/480 |
1.70 |
0.1 min. |
0.75 |
1.10 |
1.27 |
| 40 |
40 |
432/520 |
1.70 |
0.1 min. |
0.75 |
1.10 |
1.27 |
| 42.5 |
42.5 |
540/560 |
1.70 |
0.1 min. |
0.75 |
1.10 |
1.27 |
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| Package Offering |
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| ViperBGA/ L2 BGA/ CSBGA/ Tape BGA |
| Pkg size (mm) |
Row |
Column |
Total QTY |
Temp(°C) |
Vendor |
| 27X27 |
4 |
10 |
40 |
150 |
PEAK |
| 31X31 |
3 |
9 |
27 |
150 |
PEAK |
| 35X35 |
3 |
8 |
24 |
150 |
PEAK |
| 37.5X37.5 |
3 |
7 |
21 |
150 |
KO |
| 40X40 |
3 |
7 |
21 |
150 |
PEAK |
| 42.5X42.5 |
2 |
6 |
12 |
150 |
PEAK |
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