| Product Overview |
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| UFP BGA (UFP for ultra fine pitch) is a cavity down BGA with trace pitches smaller than normal BGA. UFPBGA is an IBM designed package. IBM manufactures the substrate and currently consign to ASE. Main feature of this package is the relatively smaller trace pitches compared to normal BGA. Substrate is in singulated form and encapsulation of die is via glob top process. |
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| Application |
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| Currently utilized for consumer graphics game consoles and Apple based PC system. |
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| Features |
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 Superior thermal performance
Superior electrical performance |
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| Reliability |
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| Package Level |
| MSL |
JEDEC level 3, 30°C/60% RH |
192 hours |
| PCT |
121°C/100% RH/2 atm |
168 hours |
| TCT |
-65°C~150°C |
1000 cycles |
| HAST |
130°C/85% RH |
100 hours |
| HTST |
150°C |
1000 hours |
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| Standard Process/Materials |
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| Wafer Mount |
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| Wafer Saw/ Clean |
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| 2nd Optical (Gate) |
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| Die Attach |
EPOXY: QMI 505 MT |
| Die Attach Cure |
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| Plasma Clean |
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| Wire Bond |
GOLD WIRE: 99.99% Au |
| 3rd Optical (Gate) |
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| Plasma Clean |
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| Encapsulate |
LIQUID ENCAPSULANT: HYSOL FP4450(HF)
FOR FILL & HYSOL FP4451 FOR DAM |
| Debubble |
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| Post Cure |
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| Solder Ball Mount |
SOLDER BALL: Sn/ Pb=63/ 37 |
| Flux Clean |
FLUX: WATER SOLUBLE |
| Top Side Marking |
BLACK INK |
| Ink Cure |
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| Final Visual Inspection (Gate) |
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| Packing |
BAKEABLE JEDEC TRAY |
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| Optional process: wafer back grinding / dry packing |
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