ASE Kaohsiung

BGA

PBGA
HSBGA
MCM BGA
Low & Thin
Cavity Down BGA

Product Overview

Ball-grid arrays (BGA) are IC packages which place output pins in the form of solder ball matrix. The traces of BGA are generally fabricated on laminated substrates (BT-based) or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanism (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs. Compared with traditional SMT packages, the advantages of BGA are as follows:

* Higher interconnect density
* Low assembly cost
* Self-alignment during reflow
* Lower profile
* Ease of thermal and electrical management
* Ease of routing

Key Features

Pkg type

Package size(mm)

Ball count available

Substrate

Overall thickness(mm)

Ball pitch(mm)

(1mm=39.37mil; 1mil=25.4um)

Reliability Test Plan

All the BGA packages selected for temperature/humidity test and temperature cycles are subject to precondition process per JEDEC moisture LEVEL3 prior to environmental stress. Test criterion is zero defect out of 45 sampling units.

Temp/Humidity Test	85°C/ 85% RH, 1000 hr (JEDEC 22- A101)
Pressure Cooker Test	121°C/ 100% RH/ 15 PSIG, 300 hr, 168hr (for FC-CSP, SCSP)/96hr (for FC-BGA)(JEDEC 22- A102)
Temp Cyclic Test	-65 ~ 150°C, 1000 CYCLES (MIL-STD-883-1010.7)
High Temp Storage Test	150°C, 1000 hr (JEDEC 22- A103)
High Accelerated Stress Test	130°C/ 85% RH/ 33.5 PSIA, 100 hr (JEDEC 22- A110)