| Product Overview |
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| The total thickness of the package Very Fine Pitch (VFBGA) BGA can go as low as 1.0 mm due to significant improvement in substrate and die thinning technology. |
* Small, thin and light
* Low cost and High volume production solution
* Competitive reliability performance (MSL 2) |
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| Application |
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| VFBGA is commonly used in cellular phones, hard disk drives, PLDs and digital cameras. VFBGA is a competitive solution as it addresses market demands for thin packages with high density performance. This package is highly recommended for DRAM, SRAM, Flash, EEPROM, ASIC, PLD & analog products. |
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| Features |
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 5x5 mm to 15x15 mm body size available
5~356 I/O
0.5/0.65/0.75/0.8 mm in ball pitch
Rigid & customized routing substrate design
High density interconnection
Full in-house design capability
Fine Pitch wirebond capability
Low assembly cost
Self-alignment during re-flow
High speed performance
Pb profile (Package thickness)
Lead Free & Green Package process and available
Ease of thermal and electrical management
Ease of routing
JEDEC standard criteria |
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| Reliability |
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The VFBGA package means MSL2@240°C MSL 3@260°C (Pb Free and Green requirement.)
MSL2@240°C |
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| MSL2@240°C |
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| MSL3@260°C |
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| Board Level |
| Test item |
Test condition |
First fail |
Characteristic life |
| TCT |
-40°C~125°C |
1380 cycle |
1775 cycle |
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| Package Structure |
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 |
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| Thickness (Total) |
1.0 mm Max |
| Mold cap thickness (A) |
0.45 mm |
| Substrate thickness (B) |
0.21 mm |
| Solder ball height (C) |
0.27 mm |
| Wafer thickness (D) |
7 mils |
| Epoxy (E) |
1 mil |
| Loop height (F) |
5.5 mils (Max.) |
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| Design Rule |
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| Item |
Description |
Criteria (um) |
| G-A |
Exposed bond finger metal (Double bond) |
406 min. |
| G-B |
Exposed bond finger metal (Single bond) |
280 min. |
| G-C |
Max. bond wire length |
3556 um (140 mils) Max. |
| G-D |
Bond wire center to adjacent bond pad center |
50 min. |
| G-E |
Die bond pad pitch |
50 min. |
| G-F |
Bond wire span over bond finger before target point |
90 min. |
| G-G |
Lead length in line with bond wire beyond target point |
45 min. |
| G-H |
Bond wire center to adjacent bond finger (Bottom die only) |
63.5 min. |
| G-I |
Bond finger width |
95 min. |
| G-K |
Wire center to wire center distance |
45 min. |
| G-L |
Wire bond pad size |
45 min. |
| G-M |
Bonding pad to package edge |
1000 min. |
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|
| Performance |
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| Electrical |
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| Bonding wire parastics not include: |
| VFBGA 46L 7.91x6.5 |
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Length (mm) |
R (mohm) |
Ls (nH) |
Lm (nH) |
CL (pF) |
Cm (pF) |
| Min (A4) |
1.2 |
13 |
0.64 |
0.25 |
0.28 |
0.09 |
| Max (D7) |
4.3 |
69 |
2.6 |
1.04 |
0.52 |
0.22 |
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| The above electrical data is for reference only. |
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| Thermal |
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| Package conditions: |
| Pkg type |
VFBGA 47L |
| Pkg size |
7.29x6.96x1.00 mm |
| Pitch |
0.75 mm |
| Pad size |
7.29x5.69 mm |
| Chip size |
6.30x4.63 mm |
| Substrate (layers) |
2L |
| Substrate thickness |
0.21 mm |
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| |
| PCB conditions (JEDEC JESD51-7) |
| PCB layers |
4L |
| PCB dimensions |
101.6x114.3 mm |
| PCB thickness |
1.6 mm |
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| Simulation conditions |
| Power dissipation |
2 watts |
| Ambient temperature |
55°C |
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| Simulation |
 JA (c/w) |
Psi JT (c/w) |
JB (c/w) |
JC (c/w) |
| 0/ms |
1/ms |
2/ms |
| 345 |
34.5 |
32.3 |
29.9 |
20.6 |
12 |
0.12 |
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| The above thermal data is for reference only. |
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| Package Offering |
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 |
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| The alphabetical notation refers to: |
| D1 Pkg size |
| E1 Pkg size |
| A Pkg overall thickness |
| A1 Stand-off |
| b Ball diameter |
| c Substrate thickness |
| e Ball pitch |
| |
| Pkg
size |
Ball
count |
A
(Maximum) |
A1 |
b |
c |
e |
| D1 |
E1 |
| 7.29 |
6.96 |
47 |
1 |
0.27 |
0.35 |
0.21 |
0.75 |
| 6 |
8 |
48 |
1 |
0.27 |
0.35 |
0.21 |
0.75 |
| 6.4 |
10.1 |
60 |
1 |
0.32 |
0.4 |
0.21 |
0.65 |
| 9 |
9 |
100 |
1 |
0.27 |
0.35 |
0.21 |
0.75 |
| 11 |
11 |
100 |
1 |
0.27 |
0.35 |
0.21 |
0.75 |
| 13 |
15 |
165 |
1 |
0.27 |
0.35 |
0.21 |
0.75 |
| 13 |
13 |
176 |
1 |
0.22 |
0.3 |
0.21 |
0.75 |
11 |
11 |
176 |
1 |
0.27 |
0.35 |
0.21 |
0.75 |
| 13 |
13 |
320 |
1 |
0.22 |
0.3 |
0.21 |
0.5 |
| 14 |
14 |
352 |
1 |
0.22 |
0.3 |
0.21 |
0.5 |
| 15 |
15 |
148 |
1 |
0.22 |
0.3 |
0.21 |
0.5 |
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| Packing & Shipping |
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| Body size (mm) |
|
Row |
Column |
Units per tray |
Temp(°C) |
Vendor |
| 3.9 |
3.9 |
16 |
39 |
624 |
150 |
KOSTAT |
| 7.7 |
6.2 |
12 |
38 |
456 |
180 |
DAEWON |
| 9 |
7.7 |
12 |
26 |
312 |
150 |
HS |
| 7.7 |
8.9 |
12 |
28 |
336 |
180 |
DAEWON |
| 8 |
11 |
9 |
29 |
261 |
150 |
HS |
| 7.91 |
6.5 |
20 |
9 |
180 |
200 |
3M |
| 7.29 |
6.96 |
10 |
25 |
250 |
180 |
DAEWON |
| 7.29 |
10.85 |
12 |
25 |
300 |
140 |
DAEWON |
| 7.2 |
11.65 |
8 |
20 |
160 |
150 |
SHINON |
| 6 |
10 |
13 |
23 |
299 |
150 |
HS |
| 6 |
8 |
16 |
30 |
480 |
150 |
SHINON |
| 7.7 |
9 |
12 |
28 |
336 |
180 |
DAEWON |
| 12.5 |
12 |
8 |
22 |
176 |
180 |
DAEWON |
| 6.4 |
10.1 |
13 |
22 |
286 |
150 |
HS |
| 9 |
9 |
10 |
26 |
260 |
150 |
PEAK |
| 11 |
11 |
8 |
22 |
176 |
150 |
PEAK |
| 13 |
15 |
7 |
18 |
126 |
150 |
CPAK |
| 13 |
13 |
8 |
20 |
160 |
150 |
KOSTAT |
| 11 |
11 |
8 |
22 |
176 |
150 |
PEAK |
| 13 |
13 |
8 |
20 |
160 |
150 |
KOSTAT |
| 14 |
14 |
7 |
17 |
119 |
150 |
SHINON |
| 15 |
15 |
12 |
22 |
126 |
150 |
SHINON |
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