| Product Overview |
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ASE's µBGA package is a true chip-scale package. Being only slightly larger than the die (definition of chip scale: package is less than 20% larger than the die itself), it offers significant advantages in today's world of smaller-sized electronic products. Using leading-edge materials, a copper/polyimide metallized tape is used to form the leads and the circuit of the package. A low-stress elastomeric adhesive attaches the tape to the package while the leads are bonded from the tape in an “S” shape to the standard IC bond pads. A low-stress encapsulant seals the bonded leads and eutectic solder balls are added to designed pads on the tape.
The µBGA package features short signal paths for reduced parasitics, providing excellent electrical performance. The materials technology and unique package design offer significant reliability benefits over other CSP packages. |
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| Application |
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µ-BGA package provides designers for the full scope of IC products from memory (Flash, SRAM, DRAM) to microprocessors and embedded controllers.
The versatility of the packaging technology enables a broad range of applications: PCMCIA cards; consumer and hand-held products (camcorders, cellular phones); disk drive electronics; computer CPU; and automotive electronics. |
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| Features |
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 Bond pitch 100 um
Bonding lead 40 x 19 um
Ball pitch down to 0.5 mm
Ball diameter 350 µm
Package size Die Size + 500 um |
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| Reliability |
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| Package level |
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| Test item |
Reference |
Condition/ Duration |
| MSL level 3 |
JESD 22-A113-A |
30°C/60% RH, 192 hrs |
| Temperature cycling |
MIL-STD-883D,
Method 1010.7,
Condition C |
-65°C to 150°C, air to air,
500, 1000 cycles |
| Pressure cooker |
JESD 22-A102-A |
121°C/ 100% RH, 2 atm
(30 PSI), 96,168 hours |
| HAST |
JESD 22-A110 |
130°C/85%RH, 33.5 PSI50,
100 HRS |
| High temp storage |
JESD 22-A103-A |
150°C, 500, 1000 hrs |
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| Board level |
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Test condition: -40° C ~ 125°C / cycle
Time / cycle: 1 hr
Criterion: 300 cycles around 2 years. |
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| Package |
First Failure |
Characteristic life |
| µBGA |
1610 |
1895 |
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| Performance |
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| Electrical |
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Frequency: 100 ~ 1000MHz Sweeping
µBGA 62L |
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Length (mm) |
R (ohm) |
LS (nH) |
LM (nH) |
CL (pF) |
CM (pF) |
| Min(SIQ1) |
1.2 |
23 |
0.6 |
0.03 |
0.24 |
0.02 |
| Max(RQ0) |
3.9 |
109 |
2.3 |
0.48 |
0.26 |
0.06 |
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| Thermal |
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| Package |
Die size (mm) |
Theta ja (C/W) |
| 0 (m/s) |
1 (m/s) |
2 (m/s) |
| µBGA 62L |
10 x 9.8 |
51.4 |
41.9 |
37.3 |
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| Standard Process/Materials |
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| Wafer Mount |
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| Wafer Saw/ Clean |
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| 2nd Optical (Gate) |
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| UV Erasing |
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| Die Attach |
Die Attach Adhesive: Low Stress Polymer |
| Elastomer Curing |
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| Lead Bond |
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| 3rd Optical (Gate) |
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| Plasma Clean |
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| Liquid Encapsulate |
LIQUID ENCAPSULANT: Low Stress Polymer |
| Post Mold Cure |
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| Top Side Laser Marking |
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| Solder Ball Mount |
SOLDER BALL: Sn/ Pb=63/ 37 |
| Reflow |
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| Flux Clean |
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| Package Mount |
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| Singulation |
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| UV-Erase |
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| Package Detape |
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| Final Visual Inspection (Gate) |
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| Packing |
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| Substrate: copper/polyimide |
| Optional process: wafer back grinding/die coating |
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| Packing & Shipping |
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| All the uBGAs are packed into tray. |
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