| Product Overview |
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| A special designed structure for DRAM devices. Ball grid array substrate is used instead of conventional lead frame to reduce package weight and size. A slot at the center of substrate is formed to accommodate the interconnection between center bonding pads of chip and solder balls. Better electrical performance under high frequency can be achieved due to signal transmission path reduction. |
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| Application |
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- Personal computers or notebooks
-- DRAM module
- Telecommunication products
-- Cellular phone
- Consumer products
-- Camcorder
-- Personal digital assistant
-- Digital camera
-- Memory card
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| Features |
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 Laminate substrate with ball grid array outline
Small footprint
Low profile (max. thickness 1.0mm)
Light weight
Better electrical performance under high frequency conditions
Double density and stacked structure is possible |
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| Performance |
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| Electrical |
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mm |
R (mohm) |
CL (pF) |
Cm (pF) |
Ls (nH) |
Lm (nH) |
GND (nH) |
Pwr (nH) |
| Min |
4.7 |
50 |
0.52 |
0.14 |
3.44 |
0.75 |
2.55 |
2.63 |
| Max |
9.6 |
105 |
1.23 |
0.35 |
7.4 |
2.1 |
6.87 |
6.85 |
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| Thermal |
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| COS 54L |
| Thermal Path |
Ratio |
| Die |
49.6% |
| PCB(BT,4L) |
14.4% |
| Substrate& Compound |
29.8% |
| Ball |
6.2% |
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| Standard Process/Materials |
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| Wafer Mount |
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| Wafer Saw/ Clean |
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| 2nd Optical (Gate) |
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| Die Attach |
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| Die Attach Cure |
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| Wire Bond |
Gold Wire: 99.99% Au |
| 3rd Optical (Gate) |
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| Liquid Encapsulation |
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| Post Mold Cure |
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| Top Side Laser Marking |
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| Ball Mount |
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| Singulation |
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| Final Visual Inspection (Gate) |
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| Packing |
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| Optional process: wafer back grinding/die coating |
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| Packing & Shipping |
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| Packaging tray |
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| Body Size |
Lead count |
Vendor |
| 12.45x23.00 |
416 |
HWA SHU |
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