| Product Overview |
| |
| QFN |
| |
| Based on copper lead frame, Quad Flat No-lead (QFN) or microchip carrier (MCC) uses half-encapsulation technology to expose the rear side of the die pad and the tiny fingers, which are used to connect the chip and bonding wire with the PCB. QFN packages are suitable for applications of over 12GHz working frequency. Providing both thermal and electrical en-hancement, QFN is a cost-effective packaging solution due to its economical materials and simpler packaging process. |
|
| Application |
| |
| Telecommunication products |
Cellular phones
Wireless LAN |
| |
| Portable products |
Personal digital assistants
Digital cameras |
| |
| Low to medium lead count packages |
| Information appliances |
|
| Features |
| |
 |
 Small footprint
Low profile (<0.9 mm)
Light weight
Cost effective
Better electrical performance
Better power dissipation |
|
| Reliability |
| |
| Package
Level |
| MSL |
JEDEC Level 2A 60/60 120Hrs |
*Level 1 85/ 85 168 Hrs. |
| PCT |
121°C/100%/29.7PSIA |
168 hours |
| TCT |
-65°C~150°C |
1000 cycles |
| HAST |
130°C/85% RH |
100 hours |
| HTST |
150°C |
1000 hours |
| THT |
85°C/85% RH |
1000 hours |
|
| |
| Board
Level |
| Temp
cycle |
-40°C~125°C |
2613
cycles for 7x7 48L
2938 cycles for 5x5 32L |
| Bending |
1mm deflection/2Hz |
63.2% failed 8,846 cycles
for 7x7 48L
23,853 cycles for 5x5 32L |
| Drop |
1m
height |
100
drops no failed |
|
| *Depends on PKG Size. |
|
| Performance |
| |
| Electrical |
| |
| The electrical data about leadless packages is variable. Two components - the bond wire and terminal can affect the electrical parasitic. Apparently, the effect from the terminal is trivial. Therefore, the electrical parasitic (mostly from the inductance) can be simply estimated by calculating the wire length. The empirical RLC values for gold wire in 25um diameter are 50mW /mm, 1nH/mm, and 0.06 pF/mm. |
| |
| Max Trace |
| |
| QFN (MCC) (Basd on Max. trace. Data marked with "s" are derived from simulation.) |
| F=100MHz |
Pad size |
| 3x3 16L |
1.7x1.7 |
| 4x4 24L |
2.7x2.7 |
| 5x5 32L |
3.7x3.7 |
| 7x7 48L |
5.7x5.7 |
| 8x8 56L |
6.7x6.7 |
| 9x9 64L |
7.7x7.7 |
|
|
|
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| Thermal Characterization |
| |
| For QFN, the exposed die pad has to be soldered to the PCB to maintain its thermal performance. Little improvement is found if the pad is floating. Contact ASE R&D for details. |
| |
| QFN (MCC) |
| Pkg
size |
Pad
size
(mm) |
Die
size
(mm) |
Pitch
size
(mm) |
 JA
(c/w) |
| 0 (m/s) |
1 (m/s) |
2 (m/s) |
| 3x3 16L |
1.7 |
0.53
0.27 |
0.50
0.50 |
59.1
76.2 |
56.9
74.0 |
55.0
72.1 |
| 4x4 24L |
2.7 |
1.53
0.77 |
0.50
0.50 |
32.2
40.7 |
29.9
38.4 |
28.1
36.5 |
| 5x5 32L |
3.7 |
1.73
0.87 |
0.50
0.50 |
31.0
38.3 |
28.7
35.9 |
26.9
34.1 |
| 7x7 48L |
5.7 |
3.43
1.72 |
0.50
0.50 |
23.5
27.1 |
20.98
24.6 |
19.1
22.7 |
| 8x8 56L |
6.7 |
4.43
2.22 |
0.50
0.50 |
21.5
24.4 |
18.9
21.9 |
17.1
20.0 |
| 9x9 64L |
7.7 |
5.43
2.72 |
0.50
0.50 |
19.7
22.1 |
17.1
19.5 |
15.3
17.7 |
|
| |
| The above thermal data is for reference only. |
|
| Standard Process/Materials |
| |
| QFN
(MCC) |
| Wafer
Back Grinding (Option) |
|
| Wafer Mount |
|
| Wafer
Saw/Clean |
|
| 2nd Optical (Gate) |
|
| Lead Frame
Taping |
Cu C194, PPF |
| Die Attach |
|
| Epoxy |
Silver Epoxy ( Green & Lead-free ) |
| Die Attach Cure |
|
| Wire Bond |
Gold wire: 99.99% Au |
| 3rd Optical
(Gate) |
|
| Mold |
Green & Lead-free |
| Top Side
Laser Marking |
|
| Electro De-flash |
|
| Plating
(Option) |
Sn 100% |
| Singulation |
|
| Final
Visual Inspection (Gate) |
|
Packing
|
Tray
or tube |
|
|
| Package Offering |
| |
 |
| Packaging Capability/Outline Dimension |
| |
| The alphabetical notation refers to: |
| A1 Stand-off |
| A Body thickness |
| e Lead pitch |
| |
| QFN |
| Pkg
size |
Lead
count |
A1 |
b |
e |
| D |
E |
| 3 |
3 |
12/16 |
0~0.05 |
0.9 |
0.5 |
| 4 |
4 |
16/24 |
0~0.05 |
0.9 |
0.5/0.65 |
| 5 |
5 |
28/32 |
0~0.05 |
0.9 |
0.5 |
| 6 |
6 |
36/40 |
0~0.05 |
0.9 |
0.5 |
| 7 |
7 |
32/48 |
0~0.05 |
0.9 |
0.5/0.65 |
| 8 |
8 |
52/56 |
0~0.05 |
0.9 |
0.5 |
| 9 |
9 |
64 |
0~0.05 |
0.9 |
0.5 |
|
|
| Packing & Shipping |
| |
| Tube or tray or other materials |
Tray:
| Package size |
Total
QTY (Tray) |
| 3x3 |
649 |
| 4x4 |
490 |
| 5x5 |
490 |
| 6x6 |
490 |
| 7x7 |
260 |
| 8x8 |
260 |
| 9x9 |
260 |
|
| |
Tube:
| Package
size |
Total
QTY (Tray) |
| 3x3 |
160 |
|
|
