| Product Overview |
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| BCC (bump chip carrier) uses plating metal pads (called "terminals", as small as 0.4x0.3mm) to connect with the PCB. The terminals, which are etched from copper-based lead frame during the packaging process, can be placed on the periphery of the package using in-line or staggered layout. BCC+ and BCC++ both have exposed die pads, which can be soldered to the PCB. This direct heat path enhances the thermal performance. BCC++ further enhances electrical performance by allocating a ground ring, which is extended from the die pad, to allow wire bonding. This common ground reduces the ground inductance and curb the inductive noise. BCC packages are suitable for applications of over 12GHz working frequency. |
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| Application |
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| The BCC series package is very suitable for small size and light weight packages that requires excellent electrical and thermal performance. Any application requiring high frequency and high power package performance, light weight, and small package size may choose the BCC package, especially for telecommunications (wireless applications like cellular phones, handsets, PDAs, wireless cards, base station and wireless LANs), portable products (personal digital assistants and digital camera) and low to medium lead count packages (information appliances application). |
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| Features |
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 Small package size, light weight.
Package height 0.8mm max.
Existing BOM and process flow.
Excellent thermal performance
Excellent electrical performance
Volume production
Assembly yield over 99.85%
Suitable for high frequency application.
Custom-design available |
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| Reliability |
| |
| Package Level |
| Pkg |
Body siza |
MSL |
Peak temp(°C) |
| BCC |
2.8x3.8~9x9 |
MSL 1 |
240 |
| BCC++ |
3x3 |
MSL 1 |
240 |
| BCC++ |
4x4 |
MSL 2 |
260 |
| BCC++ |
5x5 |
MSL 2 |
260 |
| BCC++ |
6x6 |
MSL 2A |
260 |
| BCC++ |
7x7 |
MSL 2A |
260 |
| BCC++ |
8x8 |
MSL 2A |
260 |
| BCC++ |
9x9 |
MSL 3 |
240 |
|
| |
| MSL for BCC+ is the same as BCC++ |
| |
| Board Level |
| Pkg |
Body siza |
TC |
Drop |
Bending |
Shear |
| BCC |
7x7 |
Pass |
Pass |
Pass |
Pass |
| BCC++ |
5x5 |
Pass |
Pass |
Pass |
Pass |
| BCC ++ |
7x7 |
Pass |
Pass |
Pass |
Pass |
| BCC ++ |
9x9 |
Pass |
Pass |
Pass |
Pass |
|
| |
| Board level is the same as BCC++ |
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| Design Rule |
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| Pkg size (mm) |
Max die space (mm) |
| BCC |
BCC+ |
BCC++ |
| 2.8X3.8 |
2.4x2.2 |
1.9x1.5 |
1.5x1.3 |
| 3X3 |
1.4x1.4 |
0.7x0.7 |
0.5x0.5 |
| 3.4X4.55 |
1.8x2.95 |
1.1x2.25 |
0.9x2.05 |
| 4.2X5.2 |
2.6x3.6 |
1.9x2.9 |
1.7x2.7 |
| 4X4 |
2.4x2.4 |
1.7x1.7 |
1.5x1.5 |
| 5X5 |
3.4x3.4 |
2.7x2.7 |
2.5x2.5 |
| 6X6 |
4.4x4.4 |
3.7x3.7 |
3.5x3.5 |
| 7X7 |
5.4x5.4 |
4.7x4.7 |
4.5x4.5 |
| 8X8 |
6.4x6.4 |
5.7x5.7 |
5.5x5.5 |
| 9X9 |
7.4x7.4 |
6.7x6.7 |
6.5x6.5 |
|
|
| Performance |
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| Electrical |
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| The electrical data about leadless packages are variable. Two components, the bond wire and terminal can effect the electrical parasitic. Apparently, the effect from the terminal is trivial. Therefore, we can simply estimate the electrical parasitic (mostly from the inductance) by calculating the wire length. The empirical RLC values for gold wire with 25um diameter are 50 m/mm, 1 nH/mm, and 0.06 pF/mm. |
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| Thermal |
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| For BCC+ and BCC++, the exposed die pad has to be soldered to PCB to maintain its thermal performance. Little improvement is found if the pad is floating. Contact ASE R&D for thermal data. |
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| BCC |
 |
|
|
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| BCC++ |
 |
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| The above thermal data is for reference only. |
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| Standard Process/Materials |
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| BCC/BCC+/BCC++ |
| Wafer mount |
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| Wafer saw/Clean |
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| 2nd optical (Gate) |
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| Die attach |
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| Epoxy: |
BCC: HYSOL CB-011
BCC+/BCC++: HITACHI EN-4900F |
| Epoxy cure |
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| Wire bond |
Gold wire: 99.99% Au |
| 3rd optical (Gate) |
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| Mold |
Compound: SHINETSU KMC-288P
 HITACHI CEL-9220THF1 |
| Post mold cure |
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| Top side laser marking |
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| Singulation |
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| Final visual inspection (Gate) |
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| Packing |
Tray: ANTI-STATIC tube |
| Optional process: wafer back grinding |
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| Package Offering |
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| BCC/BCC+/BCC++ |
| Pin count |
A |
B |
C |
D |
E |
F |
G |
H |
I |
J |
8
|
2.80 |
3.80 |
0.075 |
0.670 |
0.50 |
0.40 |
0.30 |
0.45 |
0.20 |
0.20 |
| 16 |
3.00 |
3.00 |
0.075 |
0.670 |
0.50 |
0.40 |
0.30 |
0.45 |
0.20 |
0.20 |
16
|
3.40 |
4.55 |
0.075 |
0.670 |
0.65 |
0.40 |
0.30 |
0.45 |
0.20 |
0.20 |
| 20 |
4.20 |
5.20 |
0.075 |
0.670 |
0.65 |
0.40 |
0.30 |
0.45 |
0.20 |
0.20 |
24
|
4.00 |
4.00 |
0.075 |
0.670 |
0.50 |
0.40 |
0.30 |
0.45 |
0.20 |
0.20 |
| 32 |
5.00 |
5.00 |
0.075 |
0.670 |
0.50 |
0.40 |
0.30 |
0.45 |
0.20 |
0.20 |
40
|
6.00 |
6.00 |
0.075 |
0.670 |
0.50 |
0.40 |
0.30 |
0.45 |
0.20 |
0.20 |
| 48 |
7.00 |
7.00 |
0.075 |
0.670 |
0.50 |
0.40 |
0.30 |
0.45 |
0.20 |
0.20 |
56
|
8.00 |
8.00 |
0.075 |
0.670 |
0.50 |
0.40 |
0.30 |
0.45 |
0.20 |
0.20 |
| 64 |
9.00 |
9.00 |
0.075 |
0.670 |
0.50 |
0.40 |
0.30 |
0.45 |
0.20 |
0.20 |
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| Packing & Shipping |
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| Tray is standard package offering. Material and tube are optional. |
| |
| Tube: BCC/BCC+/BCC++ |
| Lead count |
Total QTY |
Vendor |
| 8 |
114 |
KT |
| 16 |
95 |
KT |
| 20 |
83 |
KT |
| 24 |
108 |
KT |
| 32 |
86 |
KO |
| 48 |
62 |
KT |
| 64 |
48 |
KT |
|
| |
| Tray: BCC/BCC+/BCC++ |
| Lead count |
Total QTY |
Vendor |
| 24 |
416 |
HS |
| 32 |
576 |
HS |
| 40 |
429 |
PEAK |
| 48 |
416 |
HS |
| 56 |
252 |
PEAK |
| 64 |
260 |
PEAK |
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