| Product Overview |
| |
| Advanced Quad Flat No-lead. aQFN™ is solution for Lead less, multi-row and fine pitch lead frame package with enhanced Thermal/ Electrical performance. aQFN™ is a cost-effective packaging solution due to its economical materials and simpler packaging process. |
|
| Application |
| |
Telecommunication
products
Cellular phones
Wireless LAN
Portable
products
Personal digital assistants
Digital cameras
Low
to medium lead count packages
Information appliances |
|
| Features |
| |
| Low profile, small footprint and light weight |
| Free-form I/O design |
| Fine lead pitch 0.4mm |
| Excellent thermal performance |
| Excellent electrical performance |
| Good SMT performance |
| Cost effective package |
| Extend QFN I/O count up to 400 |
|
|
| Reliability |
| |
| Package Level |
| MSL |
JEDEC Level 3, 30°C/ 60% RH |
192 hours |
| PCT |
121°C/ 100% RH/ 2 atm |
168 hours |
| TCT |
–65°C ~ 150°C |
1000 cycles |
| HAST |
130°C/ 85% RH/33.5 PSIG |
96 hours |
| HTST |
150°C |
1000 cycles |
|
| |
| Board Level |
TCT |
0~100°C, 2 CPH W/10 minute ramps and 5 minute duells respectively |
1000 cycles |
Drop Test |
JEDEC standard |
30 drops Min |
|
|
