| Product Overview |
| |
| Flip Chip Organic BGA |
| Laminate or build-up organic substrate offers better electrical performance than wire-bond type BGA package especially in high frequency appplications. |
| |
| Flip Chip Ceramic BGA |
| Ceramic substrate offers better moisture resistance, electrical insulating property and higher thermal conductivity than organic substrate. FC-CBGA is used primarily for high-reliability commercial applications (e.g. CPU). |
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| Application |
| |
| Computer: |
| Graphics/chipsets for PC, Server and High-end application, Microprocessor for PC & Server, PLD, PDA. |
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| Telecommunications: |
| Network products (LAN), Switching, Transmission, Cellular Base Stations |
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| Features |
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- Substrate:
4 layer laminate, 4~8 layer build-up, and ceramic, substrates are available for different applications.
- Passive Component:
Passive component attaching is available. It can be placed on the top or bottom side of the package.
- Ceramic BGA:
High Pb solder ball with eutectic solder paste improves board level reliability performance of ceramic packages.
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| Reliability |
| |
| Package Level |
| MSL level 4 |
220°C |
| TCT-B |
1000 cycles |
| THT |
1000 hrs |
| HTST |
1000 hrs |
| PCT |
96 hrs. (For reference only) |
| HAST |
100 hrs |
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| Board Level (Contact ASE R&D for details.) |
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| Design Rule |
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| Packaging Capability/Outline Dimension (All units are in mm.) |
| |
| The alphabetical notation means: |
| A Pkg Overall thickness |
| A1 Stand-off |
| b Ball diameter |
| c Substrate thickness |
| e Ball pitch |
| |
| FC-BGA |
| Pkg size |
Lead count |
A |
A1 |
b |
c |
e |
| D1 |
E1 |
| 11 |
11 |
100 |
- |
0.4 |
0.45 |
- |
1 |
| 17 |
17 |
360 |
- |
0.6 |
0.75 |
- |
1.27 |
| 25 |
25 |
360 |
- |
0.6 |
0.75 |
- |
1.27 |
| 27 |
27 |
256~365 |
- |
0.6 |
0.75 |
- |
1.27 |
| 31 |
31 |
409/441 |
- |
0.6 |
0.75 |
- |
1.27 |
| 35 |
35 |
496~580 |
- |
0.4/0.6 |
0.45/0.75 |
- |
1/1.27 |
| 37.5 |
37.5 |
552 |
- |
0.6 |
0.75 |
- |
1.27 |
| 40 |
40 |
1521 |
- |
0.4 |
0.45 |
- |
1 |
|
| |
| (1mm=39.37mil; 1mil=25.4um) |
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| Performance |
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| Electrical (Contact ASE R&D for details.) |
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| Thermal |
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| The thermal data of flip chip packages is related to several factors, number of substrate layers, substrate thickness, substrate material, die size, and I/O pad layout. |
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|
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| *HFC BGA: High performance Flip Chip BGA (with Heat Spreader). |
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| Standard Process/Materials |
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| FC-CSP/FC-BGA/FC-CBGA |
| Wafer bumping |
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| Wafer mount |
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| Wafer saw/clean |
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| Flip chip & reflow |
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| (Flux clean) |
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| Underfill |
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| Underfill curing |
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| Top side laser marking |
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| Solder ball mount |
Solder ball: Sn/Pb=63/37 |
| Reflow |
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| Flux clean |
Flux: Water soluble |
| Singulation |
(for FC-CSP only) |
| Final visual inspection (Gate) |
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| Packing |
Bakable JEDEC tray |
|
| |
| Optional process: Dry packing/molding/heat spreader planting (for FC-BGA) |
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| Package Offering |
| |
| Pkg type |
Pkg size |
Ball pitch |
Lead count |
| FC LFBGA |
25x25 |
1.27 |
360 |
| FC LFBGA |
25x32.5 |
1.27 |
474 |
| FC LFBGA |
35x35 |
1.27 |
552 |
| FC LFPGA |
28x34 |
1.27 |
495 |
| FC LFPGA |
35x35 |
1.27 |
495 |
| FC LFPGA |
49.5x49.5 |
2.41 |
296 |
| FC LFPGA |
49.5x49.5 |
2.54 |
370 |
| FCBGA |
25x32.5 |
1.27 |
474 |
| FCBGA |
27x27 |
1.27 |
272 |
| FCBGA |
27x27 |
1.27 |
256 |
| FCBGA |
27x27 |
1.27 |
328 |
| FCBGA |
27x27 |
1.27 |
352 |
| FCBGA |
27x27 |
1.27 |
365 |
| FCBGA |
27x27 |
1.27 |
400 |
| FCBGA |
28x28 |
1.0 |
625 |
| FCBGA |
29x29 |
1.0 |
732 |
| FCBGA |
37.5x37.5 |
1.27 |
664 |
| FCBGA |
40x40 |
1.0 |
1117 |
| FCBGA |
40x40 |
1.0 |
1521 |
| HiTCE FC CBGA |
27x27 |
1.27 |
272 |
| MFC BGA |
31x31 |
1.27 |
408 |
| TFC BGA |
37.5x37.5 |
1.27 |
552 |
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| |
Notes:1. Ceramic type flip chip package is offered in BGA and PGA in the connection of  output.
2. HiTCE FC CBGA (High co-efficient of thermal expansion, flip chip ceramic BGA) is flip chip package with HiTCE ceramic substrate.
3. MFC BGA (molded flip chip BGA) is flip chip package with additional overmold encapsulation on the package.
4. TFC BGA is a die down type of flip chip package with heat spreader. |
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| Packing & Shipping |
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| FC-BGA (JEDEC tray) |
| Pkg size (mm) |
Row |
Column |
Total QTY |
Temp(°C) |
Vendor |
| 27x27 |
4 |
10 |
40 |
150 |
HS |
| 31x31 |
3 |
9 |
27 |
150 |
SHINON |
| 35x35 |
3 |
8 |
24 |
150 |
HS |
| 40x40 |
3 |
7 |
21 |
155 |
Daewon |
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