| Product Overview |
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HFC-BGA (High Performance FC-BGA), a thermally enhanced FC-BGA, is the composite package of FC-BGA with a copper heat sink. This heat sink is used to extend the heat conduction area by connecting itself to the rear side of the silicon chip.
This method desensitizes the performance deviation out of the chip size, lowers the thermal resistance of junction-to-case (JC), and enables the external heat sink or fan to work more effectively. HFC-BGA can produce 6~8 watts of power dissipation under natural convection. |
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| Application |
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| Computer: |
| Graphics/chipsets for PCs, server and high-end application, microprocessors for PCs & servers, PLD, PDA. |
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| Telecommunications: |
| Networking products (LAN), switching, transmission, cellular base stations |
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| Features |
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- Substrate:
4 layer laminate, 4~8 layer build-up, ceramic, and PTFE substrates are available.
- Therma Lids:
Heat spreaders made of Cu with Ni plating, Aluminum, Ceramic, AlSiC.
- Passive Component:
Passive component attaching. It can be placed on the top or bottom side of the package.
- Ceramic BGA:
High Pb solder ball with eutectic solder paste improves board level reliability performance of ceramic packages.
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| Reliability |
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| Package Level |
| MSL level 4 |
220°C |
| TCT-B |
1000 cycles |
| THT |
1000 hrs |
| HTST |
1000 hrs |
| PCT |
96 hrs. (For reference only) |
| HAST |
100 hrs |
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| Board Level (Contact ASE R&D for details.) |
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| Design Rule |
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| Packaging Capability/Outline Dimension (All units are in mm.) |
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| The alphabetical notation means: |
| A Pkg Overall thickness |
| A1 Stand-off |
| b Ball diameter |
| c Substrate thickness |
| e Ball pitch |
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| HFC-BGA |
| Pkg size |
Lead count |
A |
A1 |
b |
c |
e |
| D1 |
E1 |
| 27 |
27 |
256~365 |
- |
0.6 |
0.75 |
- |
1.27 |
| 31 |
31 |
409/441 |
- |
0.6 |
0.75 |
- |
1.27 |
| 35 |
35 |
496~580 |
- |
0.4/0.6 |
0.45/0.75 |
- |
1/1.27 |
| 37.5 |
37.5 |
552 |
- |
0.6 |
0.75 |
- |
1.27 |
| 40 |
40 |
1521 |
- |
0.4 |
0.45 |
- |
1 |
|
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| (1mm=39.37mil; 1mil=25.4um) |
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| Performance |
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| Electrical (Contact ASE R&D for details.) |
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| Thermal |
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| The thermal data of flip chip packages is related to several factors, number of substrate layers, substrate thickness, substrate material, die size, and I/O pad layout. |
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| Pkg type |
Ball count |
Pkg size
(mm) |
Pitch
(mm) |
Die size
(mil) |
Thermal ball |
Thermal ball |
 JA (c/w) |
0
(m/s) |
1
(m/s) |
2
(m/s) |
| FC-BGA |
365 |
27X27 |
1.27 |
350X350 |
36 |
6 |
19 |
17.4 |
15.5 |
| HFC-BGA |
365 |
27X27 |
1.27 |
350X350 |
36 |
6 |
13.6 |
12.6 |
10.8 |
| FC-BGA |
548 |
35X35 |
1.27 |
400X400 |
100 |
6 |
23.6 |
21.8 |
20.3 |
| HFC-BGA |
548 |
35X35 |
1.27 |
400X400 |
100 |
6 |
12.1 |
10.3 |
9 |
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| The above thermal data is for reference only. |
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| Standard Process/Materials |
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| FC-CSP/FC-BGA/FC-CBGA |
| Wafer bumping |
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| Wafer mount |
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| Wafer saw/clean |
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| Flip chip & reflow |
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| (Flux clean) |
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| Underfill |
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| Underfill curing |
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| Top side laser marking |
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| Solder ball mount |
Solder ball: Sn/Pb=63/37 |
| Reflow |
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| Flux clean |
Flux: Water soluble |
| Singulation |
(for FC-CSP only) |
| Final visual inspection (Gate) |
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| Packing |
Bakable JEDEC tray |
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| Optional process: Dry packing/molding/heat spreader planting (for FC-BGA) |
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| Package Offering |
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| Pkg type |
Pkg size(mm) |
Ball size(mm) |
Ball pitch(mm) |
Lead count |
| HFC BGA |
12x12 |
0.6 |
1.0 |
121 |
| HFC BGA |
13x13 |
0.5 |
1.0 |
117 |
| HFC CBGA |
15x15 |
0.6 |
1.0 |
148 |
| HFC BGA |
15x15 |
0.6 |
1.0 |
196 |
| HFC BGA |
15x15 |
0.6 |
1.0 |
296 |
| HFC CBGA |
17x17 |
0.6 |
1.0 |
255 |
| HFC CBGA |
18x18 |
0.6 |
1.0 |
284 |
| HFC CBGA |
18x18 |
0.6 |
1.0 |
286 |
| HFC BGA |
21x21 |
0.6 |
1.0 |
399 |
| HFC BGA |
23x23 |
0.5 |
1.0 |
473 |
| HFC BGA |
25x25 |
0.6 |
1.0 |
575 |
| HFC BGA |
27x27 |
0.76 |
1.27 |
272 |
| HFC BGA |
27x27 |
0.6 |
1.0 |
672 |
| HiTEC FCBGA |
27x27 |
0.76 |
1.27 |
272 |
| HFC CBGA |
27x27 |
0.76 |
1.27 |
336 |
| HFC BGA |
31x31 |
0.76 |
1.27 |
564 |
| HFC BGA |
31x31 |
0.6 |
1.0 |
575 |
| HFC BGA |
32.5x32.5 |
0.6 |
1.0 |
624 |
| HFC BGA |
35x35 |
0.6 |
1.0 |
1020 |
| HFC BGA |
35x35 |
0.6 |
1.0 |
1020 |
| HFC BGA |
35x35 |
0.6 |
1.0 |
960 |
| HFC BGA |
35x35 |
0.6 |
1.0 |
580 |
| HFC BGA |
35x35 |
0.635 |
1.0 |
680 |
| HFC BGA |
35x35 |
0.6 |
1.0 |
728 |
| HiTEC FCBGA |
35x35 |
0.6 |
1.0 |
1155 |
| HiTEC FCBGA |
35x35 |
0.6 |
1.0 |
1156 |
| HFC BGA |
35x35 |
0.76 |
1.27 |
552 |
| HFC BGA |
37.5x37.5 |
0.76 |
1.27 |
829 |
| HFC BGA |
40x40 |
0.6 |
1.0 |
1092 |
| HFC BGA |
40x40 |
0.635 |
1.0 |
1280 |
| HFC BGA |
40x40 |
0.6 |
1.0 |
1428 |
| HFC BGA |
40x40 |
0.635 |
1.0 |
1444 |
| HFC BGA |
40x40 |
0.6 |
1.0 |
1417 |
| HFC BGA |
40x40 |
0.6 |
1.0 |
1521 |
| HFC BGA |
40x40 |
0.6 |
1.0 |
569 |
| SBS HFC BGA |
40x40 |
0.76 |
1.27 |
569 |
| HFC BGA |
42.5x42.5 |
0.6 |
1.0 |
1600 |
| HFC BGA |
42.5x42.5 |
0.6 |
1.0 |
1680 |
| HFC BGA |
45x45 |
0.76 |
1.27 |
652 |
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Notes:1. HiTCE HFC CBGA is thermally enhanced flip chip package with HiTCE ceramic  substrate.
2. SBS HFCBGA (Side-by side high performance flip chip BGA) is thermally enhanced flip chip package with multiple chips on a package. |
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| Packing & Shipping |
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| HFC-BGA (JEDEC Tray) |
| Body size (mm) |
Row |
Column |
Total QTY |
Temp(°C) |
Vendor |
| 27x27 |
4 |
10 |
40 |
150 |
HS |
| 31x31 |
3 |
9 |
27 |
150 |
SHINON |
| 35x35 |
3 |
8 |
24 |
150 |
HS |
| 40x40 |
3 |
7 |
21 |
150 |
Daewon |
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