| Product Overview |
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FC-CSP (Flip Chip Chip Scale Package) offers chip scale capacity for the I/Os of 200 and less. FC-CSP provides better protection for chip and better solder joint reliability compared with direct chip attach (DCA) or chip on board (COB). FC-CSP is more superior to known good die (KGD) in low-cost test and burn-in, and performs comparable electrical function with KGD. FC-CSP features thin and small profile, and lightweight packages.
Applications include RFICs and memory ICs. ASE provides packaging service for any customer-designed size at the ball pitches ranging from 0.5 to 1.0mm, and the I/O from 16 to 200. The types of encapsulation of FC-CSP are underfill type and overmold. |
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| Application |
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| Consumer: |
| Camcorder, Digital Camera, DVD, etc. |
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| Computer: |
| Voltage regulators, High-Speed Memory, Card PC, Peripherals, etc. |
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| Telecommunications: |
| Pagers, Cellular handsets, etc. |
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| Features |
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- Thinner Profile
"Wafer Thinning" capability (down to 8 mils) to support packages thinner than 1.0 mm package.
- Substrate
2-layer BT laminate substrate is used to reduce overall package cost.
- Improved Performance
Thin core (100 um) substrate & via-on-pad design can be adopted to achieve better electrical performance.
- Robust Structure
Overmolded process can enhance throughput, component and board level reliability.
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| Reliability |
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| Package Level |
| MSL level 3 |
220°C |
| TCT-B |
1000 cycles |
| THT |
1000 hrs |
| HTST |
1000 hrs |
| PCT |
168 hrs |
| HAST |
100 hrs |
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| Board Level |
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| Weibull distribution of FC-CSP 48L with different surface finish and 0.30 mm dia. Sn 63/Pb 37 solder ball. Test Condition: -40°C~125°C air-to-air. |
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| Design Rule |
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| Packaging Capability/Outline Dimension (All units are in mm.) |
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| The alphabetical notation means: |
| A Pkg Overall thickness |
| A1 Stand-off |
| b Ball diameter |
| c Substrate thickness |
| e Ball pitch |
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| FC-CSP |
| Pkg size |
Lead count |
A |
A1 |
b |
c |
e |
| D1 |
E1 |
| 7 |
7 |
48/49 |
1~1.4* |
0.2 |
0.3 |
- |
0.75/0.8 |
| 8 |
8 |
64 |
1~1.4* |
0.2 |
0.3 |
- |
0.8 |
| 11 |
11 |
100 |
1~1.4* |
0.4 |
0.45 |
- |
1 |
| 15 |
15 |
196 |
1~1.4* |
0.4 |
0.45 |
- |
1 |
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| (1mm=39.37mil; 1mil=25.4um) |
| *Depended on the die and substrate thickness |
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| Performance |
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| Electrical (Contact ASE R&D for details.) |
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| Thermal |
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| The thermal data of flip chip packages is related to several factors; number of substrate layers, substrate thickness, substrate material, die size, and I/O pad layout. (Contact ASE R&D for details.) |
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| Standard Process/Materials |
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| FC-CSP/FC-BGA/FC-CBGA |
| Wafer bumping |
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| Wafer mount |
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| Wafer saw/clean |
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| Flip chip & reflow |
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| (Flux clean) |
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| Underfill |
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| Underfill curing |
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| Top side laser marking |
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| Solder ball mount |
Solder ball: Sn/Pb=63/37 |
| Reflow |
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| Flux clean |
Flux: Water soluble |
| Singulation |
(for FC-CSP only) |
| Final visual inspection (Gate) |
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| Packing |
Bakable JEDEC tray |
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| Optional process: Dry packing/molding/heat spreader planting (for FC-BGA) |
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| Package Offering |
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| Pkg type |
Pkg size |
Ball pitch |
Lead count |
| FC LFBGA |
6x8 |
0.8mm |
48 |
| FC LFBGA |
6x8 |
0.75mm |
48 |
| FC LFBGA |
7x7 |
0.8mm |
48 |
| FC LFBGA |
7x7 |
0.75mm |
49 |
| FC LFBGA |
8x8 |
0.8mm |
144 |
| FC LFBGA |
11x11 |
1.0mm |
100 |
| FC LFBGA |
15x15 |
0.8mm |
120 |
| * MFC LFBGA |
4x4 |
0.8mm |
16 |
| * MFC LFBGA |
7x7 |
0.8mm |
49 |
| * MFC LFBGA |
8x8 |
0.8mm |
49 |
| * MFC LFBGA |
7x7 |
0.5mm |
100 |
| * MFC LFBGA |
7x7 |
0.5mm |
113 |
| * MFC LFBGA |
11x11 |
1.0mm |
100 |
| * MFC LFBGA |
14x22 |
0.8mm |
209 |
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| *MFC BGA: Molded only Flip Chip BGA |
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| Packing & Shipping |
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| Tube or tray or other materials |
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| FC-CSP (JEDEC Tray) |
| Pkg size (mm) |
Row |
Column |
Total QTY |
Temp(°C) |
Vendor |
| 7x7 |
13 |
32 |
416 |
150 |
PEAK |
| 8x8 |
12 |
30 |
360 |
140 |
Daewon |
| 11x11 |
8 |
12 |
96 |
150 |
PEAK |
| 15x15 |
7 |
18 |
126 |
165 |
Daewon |
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