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| SiP MPBGA |
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| Product Overview |
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| The need for high density, high performance, and cost effectiveness has helped speed the development of System-on-a-Chip (SoC) and System in a Package (SiP). The most current assembly technology is the Multi-Chip Module (MCM) package. It integrates different functions of chips such as microprocessors, memory, logic, optic ICs and capacitors, onto mini-substrates, instead of placing individual packages onto a large PCB (also known as second level package). |
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| Application |
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ASE’s MPBGA (Multi Package Ball Grid Array) utilizes the MCM assembly method. It employs the latest IC packaging technology for high-density products. The electrical and thermal performance and the affordability of the MPBGA package enables system designers to integrate several devices (Known Good Die) onto a single IC package. ASE has been in volume production since Q1, 2002.
The integration of several semiconductor technologies onto a single MPBGA package offers excellent advantages for many applications where size, weight, electrical performance, and board density are critical requirements. The high-speed performance and improved thermal capability of the MPBGA package are also excellent for personal computing, networking, graphic chip, data communication, consumer IC, telecommunication, analog/digital, ASIC, and memory applications. |
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| Features |
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| Known good die |
| Reduced size and weight |
| Improved Silicon efficiency |
| Reduced signal delay & noise |
| Lower power consumption |
| Enhanced speed & bandwidth |
| Excellent electrical performance by shrinking the board level interconnection into a package level |
| Customized-design of substrate routing |
| Space saving |
| System integration |
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| Reliability |
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| Package Level |
MPBGA (31x31 PBGA+12x12 CSP)
| MSL |
JEDEC level 3 30°C/60%, 192 hours, IRx3, 220C |
| HAST |
130°C/85% RH, 33.5 PSI, 50/100, hrs |
| TCT |
-65°C~150°C, 1000 cycles |
| HTST |
150°C 1000 hours |
| THT |
85°C/85%, 100 hours |
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Lead Free Capability (Q3/2002 ready)
| MSL |
JEDEC level 3 30°C/60%, 192 hours, IRx3, 260C |
| HAST |
130°C/85% RH, 33.5 PSI, 50/100, hrs |
| TCT |
-55°C~125°C, 1000 cycles |
| HTST |
150°C 1000 hours |
| THT |
85°C/85% 1000 hours |
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| Board Level |
MPBGA (35x35 PBGA+12x12 CSP)
| Temp cycle |
-40°C~125 |
No failure 702 cycles (W/O under fill) |
| Temp cycle |
40°C~125 |
No failure 1300 cycles (W/O under fill) |
| Bending |
1mm deflection/1Hz |
63.2% failed 272200 cycles (W/O under fill) |
| Drop |
1m Height |
100 drops no failed between CSP |
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