| Product Overview |
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ASE offers stacked Ball Grid Allay package that combines BGA package solutions onto MCM type. Stacked BGAs are also one of the most SiP popular package solutions for flash & SRAM combination.
For more information on how SiP Stacked BGA can solve your packaging problems. Contact your local ASE office for further information. |
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| Application |
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| The integration of several semiconductor technologies into single MCM BGA package offers excellent advantages for many applications where size, weight, electrical performance and board density are important considerations. |
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| Features |
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| 23x23 mm to 45x45 mm body size available |
| Full in-house design capability |
| Fine Pitch wirebond capability |
| Pb free process available |
| High speed performance |
| Good thermal performance |
| Different devices integrated onto one package |
| Cost effective solution for high density package |
| Eliminate the use of second level package |
| Good electrical performance |
| JEDEC standard compliant |
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| Reliability |
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| Package Level |
| Test Item |
Reference Standard |
Condition/Duration |
| MSL |
JEDEC 22-A103 |
Level 3, 30°C/60% RH, 192 hrs |
| TCT |
JEDEC 22-A104-B |
-65°C to 150°C, 1000 cycles |
| HAST |
JEDEC 22-A118 |
130°C/85% RH, 33.5 psi 96 hrs |
| HTST |
JEDEC 22-A103-B |
150°C, 1000 hrs |
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