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Test Services Advanced Application Testing Roadmap Technology Item 2008 2009 2010 PCI-E (Gbps) 5.0 8.0 8.0 SATA (Gbps) 1.5 3.0 6.0 FSB (Mbps) 1066 1333 - HyperTransport (Gbps) 2.8 3.6 5.2 MPU (bit) 32 64 64 HDMI (Gbps) 1.65 1.65 - Wireless Lan (GHz) 2.4 2.4 5 Cordless Phone Transceiver (GHz) 5.8 - - FT Handler Roadmap Calendar 2008 2009 2010 Temperature Range -55 ~ 155  50 ~ 155 -55 ~ 155 -55 ~ 175  50 ~ 175 -60 ~ 175 -55 ~ 200  50 ~ 175 -60 ~ 175 Multi-site Test Octal Twelve Hex Octal Twelve Hex Octal Package Size(max) 52.5*52.5 52.5*52.5 15*15 52.5*52.5 52.5*52.5 15*15 52.5*52.5 52.5*52.5 15*15 Package Size(min) 5.0*5.0 3.0*3.0 2.5*2.5 4.0*4.0 3.0*3.0 2.5*2.5 4.0*4.0 3.0*3.0 2.5*2.5 Pick & Place MT9510 Pick & Place NS6040 NS7080 Gravity MT-9308 SO-1000 MT-9918 Socket Roadmap Technology Item 2008 (plan to qual) 2009 (plan) 2010 (plan) BGA Socket Pitch 0.35 mm 0.3 mm 0.3 mm QFN Socket Triple Row Quad Row Quad Row ASE Pogo Pin Socket Test Bandwidth 6 GHz 6 GHz 6 GHz ASE Pogo Pin Socket Test Temperature 125°C 150°C 170°C ASE Socket Mechanical Tolerance ±0.02 mm ±0.02 mm ±0.02 mm Device Package Tolerance Need Assy-site to control in Need ±0.03 mm Need ±0.02 mm Need ±0.02 mm Probing Roadmap Calendar 2008 2009 2010 Temperature Range -50 ~ 200 -50 ~ 200 -50 ~ 200 RF-Probing 2.5G Hz 5G Hz 10G Hz Pad wafer Probing    In-line pad pitch 40um 35um 30um    Stagger pad pitch 20/40um 20/40um 18/35um    Tri-tiers pad pitch 25/40um 25/40um 18/35um    Quad-tiers pad pitch 25/40um 25/40um 18/35um Vertical Probing    Vertical ball pitch 150um 140um 130um    VPC ball pitch 150um 140um 130um    Pogo ball pitch 250um 150um 120um    Membrane Ball pitch 55um 45um 40um System And Product Roadmap of Burn-In Technology Item 2008 2009 2010 Device Power Consumption 2000W 200W 200W Active temperature control (ATC) /Response time 0.5 Sec 0.5 Sec 0.5 Sec Active temperature control/Accuracy +/- 3°C +/- 3°C +/- 3°C ATC socket heat dissipation 200W 200W 200W Voltage Level 0.9V 0.7V 0.7V Voltage Accuracy 10mV 10mV 10mV High Frequency Clock (Free Clock) 200MHz 200MHz 200MHz Analog Capability 2 channels 2 channels 2 channels SLT System & product roadmap Calendar 2008 2009 2010 Max Pin Count 2000 2000 2800 Max DUT 6 6 24 Max Package Size 50*50mm 50*50mm 52.5*52.5mm Mim Package Size 4*4mm 3*3mm 3*3mm Device Power Consumption 150W 200W 200W Product Audio/Video LVDS 1366/768 LVDS 1920/1080 LVDS 1920/1080 Product ChipSet Bus: 64bit DDR2 Bus: 64bit DDR3 Bus: 64bit DDR3 2008 ASE Kaohsiung, All rights reserved. Terms of Use