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About ASE Kaohsiung
Company Overview
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Vision & Mission
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Philosophy & Culture
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Social Responsibility
Environment Management
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Safety & Health Management
Products
Dual-in-Line
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SOJ
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SOP/SSOP
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TSOP(I) (II)
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QUAD
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PLCC
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QFP
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LQFP/TQFP
HQFP
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BGA
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PBGA
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HSBGA
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MCM BGA
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Side by Side
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Stacked
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Low & Thin
TFBGA
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LFBGA
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Film BGA
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Cavity Down BGA
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ViperBGA
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CSBGA
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Tape BGA
UFPBGA
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CSP
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VFBGA
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µBGA
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COS
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Leadless
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QFN
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BCC/BCC+/BCC++
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LGA
Flip Chip
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FC-BGA
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HP FC-BGA
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FC-CSP
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Wafer Bumping
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Solder Bumping
Gold Bumping
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12" Bumping
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Ultra CSP
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3D Package
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Green Packaging
Services
Characterization Services
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Substrate Design Services
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Test Services
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e-Packaging
Total Quality Management
ASE Quality Policy
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Key Quality Roadmap
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Quality Certification
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QA Organization
Career
Human Resource Development
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Training and Development
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Compensation and Benefits
Career Opportunities
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