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About ASE Kaohsiung
Company Overview | Vision & Mission | Philosophy & Culture | Social Responsibility
Environment Management | Effluent Monitor | Safety & Health Management
ASEKH Ethics


Products
QUAD | QFP | LQFP/TQFP | Stacked Leadframe | BGA | PBGA | Stacked PBGA
Side by Side BGA | HSBGA | Cavity Down BGA | L2BGA | CSBGA | PGA | CSP
Leadless-BCC/BCC+/BCC++ | Leadless-QFN | Leadless-LGA | Leadless-aQFN™
FBGA - LF/TF/VF/WF/UF BGA | aCSP™/WLCSP | FCCSP | Stacked CSP | SiP | MPBGA
Side by Side BGA | SiP Module | Stack Leadframe - QFP/LQFP/TQFP | Stacked PBGA
Stacked CSP | Hybrid (Flip Chip + Wire Bond) | PiP (Package-in-Package)
PoP (Package-on-Package) | Flip Chip | Flip Chip CSP (FCCSP) | Flip Chip BGA (FCBGA)
HP Flip Chip BGA Ultra CSP | Bumping | Green Packaging


Services
Characterization Services | Substrate Design Services | Test Services | eService


Quality Management

ASE Quality Policy | Key Quality Roadmap | Quality Certification | QA Organization



Career
ASE Briefs | Benefits and Working Life | Human Resource Development
Training and Development | Working Opportunities | Recruiting Activities
R&D Substitute Service





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