Lead frame: C7025 (Cu)
SUMITOMO
EME-7372 (For exposed pad LQFP/TQFP)| Epoxy: ABLESTIK 8361H (Lead Free:ABLESTIK 8340A) Lead frame: C7025 (Cu) |
| Gold wire: 99.99% Au |
| Compound: SUMITOMO EME-7320 (Lead Free:HITACHI 9200THF) SUMITOMO
EME-7372 (For exposed pad LQFP/TQFP) |
| Solder: Sn/Pb=85/15(Lead Free:Sn/Cu 98/2) |
| White ink |
| Bakeable thin tray |