| Normal packaging option | Lead free option |
| Epoxy: ABLESTIK
2100A Substrate: BT resin |
Epoxy: ABLESTIK
2100A Substrate: BT resin |
| Gold wire: 99.99% Au | |
| Compound: SUMITOMO 7720TA | Compound: SUMITOMO G770 |
| White ink/Laser marking | White ink/Laser marking |
| Solder ball: Sn/Pb=63/37 | Solder ball: Sn/Ag/Cu=95.5/4.0/0.5 |
| Flux:Wafer soluble | |
| Bakeable JEDEC tray |