| Description | Criteria | Remark | |
| Die thickness | 15 mils mil |
||
| Epoxy thickness | 2~4 mils | ||
| Distance between
encapsulation edge to solder ball |
10 mils Min. | ||
| Die edge to cavity |
L2BGA: 20 mils Min. CSBGA: 25 mils Min. |
||
| Cavity depth | 25 mils nom. | ||
| Clearance
between compound & ball (Stand off) |
1.27 mm ball pitch with 0.75 mm solder ball 0.1 mm (4 mils) min |
||
| 1.0
mm Ball Pitch with 0.65 mm solder ball 0.1 mm (4 mils) min |
|||
| Solder ball height | 1.27 mm ball pitch | 0.60.1
mm pad opening-0.55 mm |
Solder mask defined is required |
| Teca 460 (White ink) | 0.50.1
mm pad opening-0.35mm |
||
| Loop height |
1.27 mm ball pitch with 0.75 mm solder ball 12 mils max |
In
line 4 wire groups
(Ring+Finger), Staggered 3 wire
groups (Ring+Finger) |
1. All Inner pads must bond to  outer finger only |
| 1.0
mm ball pitch with 0.65 mm solder ball 10 mils max |
In
line3 wire groups
(Ring+Finger), Staggered 2 wire
groups (Ring+Finger) |
2. Solder Mask Between Rings is required |
|