Mold cap thickness (B) Die thickness (C) Substrate thickness (D) Pkg edge to land (G) Land Type
0.7 0.3 0.36 0~0.1 SMD/NSMD
0.7 0.3 0.26 0~0.1 SMD/NSMD
0.53 0.25 0.36 0~0.1 SMD/NSMD
0.53 0.25 0.26 0~0.1 SMD/NSMD
0.45 0.175 0.26 0~0.1 SMD/NSMD
0.45 0.175 0.21 0~0.1 SMD/NSMD
0.45 0.175 0.15 0~0.1 SMD/NSMD