Leadiess				V(F)BGA	T(F)BGA	L(F)BGA
BCC	BCC+	BCC++	LGA
8~64	8~64	8~96	32~52	5~352	40~329	64~320
Wire bonding	Wire bonding	Wire bonding	Wire bonding	Wire bonding	Wire bonding	Wire bonding
Terminal	Terminal	Terminal	Terminal	Solder ball	Solder ball	Solder ball
0.5/0.65	0.5/0.65	0.5/0.65	0.5/0.65	0.5/0.65/0.75/0.8	0.5/0.75/0.8/1	0.5/0.75/0.8/1
0.75	0.75	0.75	0.8~0.9	<=1	1.05~1.2	1.05~1.2
34%~68%	16%~55%	12%~52%	46%~75%	~1(2)	~1(2)	~1(2)
-	Thermally enhanced	Thermally enhanced	Thermally enhanced	-	-	-