| Normal packaging option | Lead free option |
| Epoxy: ABLESTIK 2100A/QMI536 Substrate: Bt resin |
Epoxy: ABLESTIK 2100A Substrate: Bt resin |
| Gold wire: 99.99% Au | Gold wire: 99.99% Au |
| Compound: SUMITOMO EME-7720TA | Compound: SUMITOMO G770 |
| White ink/Laser marking | White ink/Laser marking |
| Solder ball: Sn/Pb=63/37 | Solder ball: Sn/Ag/Cu=95.5/4.0/0.5 |
| Flux: Water soluble | Flux: Water soluble |
| Bakeable jedec tray | Bakeable jedec tray |