JA
(c/w) | Pkg size (mm) | Pitch (mm) | Die size (mil) | Thermal ball | Substrate layer | JA
(c/w) |
Remark | ||
| 0 (m/s) | 1 (m/s) | 2 (m/s) | ||||||
| 27X27 | 1.27 | 350X350 | 36 | 6 | 19 | 17.4 | 15.5 | s |
| 27X27 | 1.27 | 350X350 | 36 | 6 | 13.6 | 12.6 | 10.8 | s |
| 35X35 | 1.27 | 400X400 | 100 | 6 | 23.6 | 21.8 | 20.3 | - |
| 35X35 | 1.27 | 400X400 | 100 | 6 | 12.1 | 10.3 | 9 | - |